Patents by Inventor Klaus Telgenbüscher

Klaus Telgenbüscher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9230829
    Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: January 5, 2016
    Assignee: TESA SE
    Inventors: Klaus Telgenbüscher, Judith Grünauer, Jan Ellinger
  • Publication number: 20130264724
    Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.
    Type: Application
    Filed: November 3, 2011
    Publication date: October 10, 2013
    Applicant: Tesa SE
    Inventors: Klaus Telgenbüscher, Judith Grünauer, Jan Ellinger