Abstract: The present invention relates to an integrated circuit for a temperature compensated crystal oscillator having an external crystal. The integrated circuit comprises a temperature compensation having one fixed or at least two selectable 3rd and/or 4th and/or 5th and/or higher order temperature compensation functions for at least one specific type of external crystal. The temperature compensation can be calibrated at one temperature, in other words without use of temperature variation, by means of an external voltage or current source overdriving a respective temperature-dependent voltage or current supplied from an internal temperature sensor to the temperature compensation.

Abstract: A method of manufacturing a crystal oscillator, in which method semiconductor components and the crystal or another resonator (1) are joined to a bottom base (4), most suitably to the printed circuit board material. The components (2, 3, 5) are joined by soldering or gluing to said bottom base and the crystal and another resonator (1) are installed, in regard to other components (2, 3, 5), using the bottom base area on the same spot.

Abstract: A component case comprising one or more micro circuits (6), where the micro circuit component is placed on a base, most suitably on a printed circuit board and said component is joined to the base with a known reversing circuit or thread bonding techniques and the base has elevations (5) placed around said component. The base is flexible and in order to stiffen the structure a stiff structure is placed on it, as a sheet metal (10), a component or another similar structure of layers and the inside centre space of the case is filled with glue or plastic.

Abstract: The present invention relates to an integrated circuit for a temperature compensated crystal oscillator having an external crystal. The integrated circuit comprises a temperature compensation having one fixed or at least two selectable 3rd and/or 4th and/or 5th and/or higher order temperature compensation functions for at least one specific type of external crystal. The temperature compensation can be calibrated at one temperature, in other words without use of temperature variation, by means of an external voltage or current source overdriving a respective temperature-dependent voltage or current supplied from an internal temperature sensor to the temperature compensation.

Abstract: The present invention relates to an integrated circuit for a temperature compensated crystal oscillator having an external crystal. The integrated circuit comprises a temperature compensation having one fixed or at least two selectable 3rd and/or 4th and/or 5th and/or higher order temperature compensation functions for at least one specific type of external crystal. The temperature compensation can be calibrated at one temperature, in other words without use of temperature variation, by means of an external voltage or current source overdriving a respective temperature-dependent voltage or current supplied from an internal temperature sensor to the temperature compensation.

Abstract: The present invention relates to an integrated circuit for a temperature compensated crystal oscillator having an external crystal. The integrated circuit comprises a temperature compensation having one fixed or at least two selectable 3rd and/or 4th and/or 5th and/or higher order temperature compensation functions for at least one specific type of external crystal. The temperature compensation can be calibrated at one temperature, in other words without use of temperature variation, by means of an external voltage or current source overdriving a respective temperature-dependent voltage or current supplied from an internal temperature sensor to the temperature compensation.

Abstract: A crystal oscillator module and method to manufacture the crystal oscillator module by sandwich method on a bottom-base, as a printed board (4), where the oscillator crystal (1) is for instance fixed onto the surface of the printed district board (4). On the opposite surface of the printed district board, at least partly at oscillator crystal (1), in order to increase the thickness of the printed district board (4), one or several elements (5) are fixed, by means of which a cavity is formed for components included module.