Abstract: Thermoplastic molding compositions comprising A) from 10 to 93% by weight of a thermoplastic polyester B) from 1 to 20% by weight of a phosphinic salt C) from 1 to 20% by weight of a nitrogen-containing flame retardant D) from 5 to 50% by weight of a long-fiber reinforcing material with fiber length from 2 to 25 mm and L/D ratio from 500 to 4000 E) from 0 to 50% by weight of other additives, where the total of the percentages by weight of components A) to E) is 100%.

Abstract: The thermoplastic molding composition comprises a) from 30 to 95% by weight of at least one aliphatic polyamide or copolyamide, as component A, b) from 1 to 30% by weight of at least one cyclic phenoxyphosphazene having at least 3 phenoxyphosphazene units, as component B, c) from 1 to 15% by weight of red phosphorus, as component C, d) from 0.1 to 20% by weight of at least one impact-modifying polymer, as component D, e) from 0 to 50% by weight of glass fibers, as component E, and f) from 0 to 30% by weight of further additives, as component F, where the total amount of components A to F gives 100% by weight.

Abstract: The invention relates to thermoplastic molding compositions comprising A) from 10 to 97% by weight of a thermoplastic polyamide, B) from 0.1 to 60% by weight of red phosphorus, C) from 1 to 25% by weight of a polyacrylonitrile homopolymer, D) from 0 to 40% by weight of an impact modifier, E) from 0 to 40% by weight of magnesium hydroxide, and F) from 0 to 60% by weight of further additives, where the total of the percentages by weight of A) to F) is 100%.

Abstract: The invention relates to thermoplastic molding compositions comprising A) from 10 to 97% by weight of a thermoplastic polyester, B) from 0.1 to 60% by weight of red phosphorus, C) from 1 to 25% by weight of a polyacrylonitrile homopolymer, D) from 0 to 50% by weight of a fibrous or particulate filler, and E) from 0 to 60% by weight of further additives, where the total of the percentages by weight of A) to E) is 100%.

Abstract: Thermoplastic molding compositions comprising A) from 29 to 97.5% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of melamine cyanurate, C) from 0.5 to 10% by weight of an organic phosphorus compound based on 9,10-dihydro-9-oxa-10-phosphaphenanthrene oxide (DOPO) as parent structure, D) from 1 to 50% by weight of a fibrous filler, the aspect ratio (L/D) of which is from 4 to 25, and the arithmetic average fiber length of which is from 40 to 250 ?m, and E) from 0 to 50% by weight of further additives, where the total of the percentages by weight of components A) to E) is 100%.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 98% by weight of a thermoplastic polyamide, B) from 0.1 to 60% by weight of red phosphorus, C) from 0.5 to 20% by weight of a melamine compound, D) from 1 to 30% by weight of titanium dioxide in the rutile form, E) from 0 to 40% by weight of an impact modifier, and F) from 0 to 60% by weight of further additives, where the sum of the percentages by weight of components A) to F) is 100%.

Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99.4% by weight of at least one thermoplastic polyamide B) from 0.5 to 20% by weight of a melam compound C) from 0.1 to 60% by weight of red phosphorus F) from 0 to 60% by weight of other additives, where the total of the percentages by weight of A) to D) is 100%.

Abstract: The thermoplastic molding composition comprises a) from 30 to 95% by weight of at least one aliphatic polyamide or copolyamide, as component A, b) from 1 to 30% by weight of at least one cyclic phenoxyphosphazene having at least 3 phenoxyphosphazene units, as component B, c) from 1 to 15% by weight of red phosphorus, as component C, d) from 0.1 to 20% by weight of at least one impact-modifying polymer, as component D, e) from 0 to 50% by weight of glass fibers, as component E, and f) from 0 to 30% by weight of further additives, as component F, where the total amount of components A to F gives 100% by weight.

Abstract: Thermoplastic molding compositions comprising A) from 29 to 97.5% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of melamine cyanurate, C) from 0.5 to 10% by weight of an organic phosphorus compound based on 9,10-dihydro-9-oxa-10-phosphaphenanthrene oxide (DOPO) as parent structure, D) from 1 to 50% by weight of a fibrous filler, the aspect ratio (L/D) of which is from 4 to 25, and the arithmetic average fiber length of which is from 40 to 250 ?m, and E) from 0 to 50% by weight of further additives, where the total of the percentages by weight of components A) to E) is 100%.

Abstract: A casing for an electronic device is produced from a heat-resistant, flame-retardant thermoplastic by an injection-molding process. This thermoplastic is a polyimide-based plastic with halogen-free flame retardancy.

Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99.4% by weight of at least one thermoplastic polyamide B) from 0.5 to 20% by weight of a melamine compound C) from 0.1 to 60% by weight of red phosphorus D) from 0 to 60% by weight of other additives, where the total of the percentages by weight of A) to D) is 100%.

Abstract: The invention relates to a casing for an electronic device, the casing being produced from a heat-resistant, flame-retardant thermoplastic by an injection-molding process. This thermoplastic is a polyamide-based plastic with halogen-free flame retardancy.