Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: Fiber-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibers and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 ?m, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fiber-reinforced thermoset moldings.

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: Fibre-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibres and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 ?m, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fibre-reinforced thermoset mouldings.

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract: The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.

Abstract: The present invention relates to wire coatings which containa) 20 to 50% by weight of a tris-2-hydroxyethyl isocyanurate-modified polyester,b) 2 to 35% by weight of a bismaleimide resin,c) 0.1 to 3% by weight of a catalyst, preferably a titanate catalyst, andd) 35 to 77% by weight of organic solvents, with respect to the total weight of the wire coating, which is 100% by weight. The invention also relates to processes for the preparation of the wire coatings according to the invention.