Patents by Inventor Klaus Weimann

Klaus Weimann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5792980
    Abstract: A device for the production of explosive formed projectiles includes a cag with an explosive filling, an ignition device arranged at the bottom and a disc-shaped metal insert covering the top of the explosive filling. In order to produce several projectiles or a single projectile composed of several such projectiles with a large l/d ratio, the insert includes at least two discs, arranged directly behind each other.
    Type: Grant
    Filed: May 21, 1990
    Date of Patent: August 11, 1998
    Assignee: Fraunhofer-Gesellschaft zur Forderung der ange-wandten Forschung e.v.
    Inventor: Klaus Weimann
  • Patent number: 5153373
    Abstract: A warhead including a shell which encloses the explosive charge and a projectile forming liner with the liner being disposed so that its circumferential surface lies against an intermediate ring which, in turn, is fastened to the shell. To avoid undefinable spalling effects in the region of the boundary surfaces between the liner and the shell, which could result in asymmetrical tail formation for the projectile produced by the detonative resharping of the liner, the intermediate ring and the liner have the same acoustic impedance.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: October 6, 1992
    Assignee: Rheinmetall GmbH
    Inventors: Henrik R. Lips, Jurgen Bocker, Peter Tripptrap, Klaus Weimann
  • Patent number: 4982667
    Abstract: An arrangement for production of explosively formed projectiles consists of casing with explosive contents, a fuse arranged on the base side and a metal insert which covers the explosive contents on the head side, in which case the projectile acquires wing-like symmetrical folds on its tail by means of the following. The insert and/or the explosive contents and/or the fuse in their outside area and/or the casing on its jacket features at least three inhomogeneities arranged at a distance from the axis of the casing in a symmetrical manner around the circumference such that in the circumferential area of the insert varied. Acceleration is achieved according to the configuration of the inhomogeneities or the impact time of the shock wave or its impact energy is different.
    Type: Grant
    Filed: October 28, 1988
    Date of Patent: January 8, 1991
    Assignee: Franhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventor: Klaus Weimann
  • Patent number: 4223331
    Abstract: A thyristor having a common-anode main thyristor and auxiliary thyristor combination integrated in a semiconductor chip with at least four alternating zones of different conductivity types. A first control electrode contacts a small-area control zone recessed in an emitter region. A first ring zone which is at least as highly n-doped as an emitter zone is disposed in the recessed control zone and is partially contacted by a second control electrode, as is also a portion of a p-doped base zone emerging at various places on the chip surface, the p-doped base zone forming a shorted auxiliary emitter. The second control electrode as well as the first control electrode, have leads separately brought out of the thyristor case, as are leads connected to a main cathode terminal and an auxiliary cathode terminal. The second control electrode together with the auxiliary cathode terminal can be used as a trigger-pulse source, or the second control electrode can alone be used as the trigger input to the thyristor.
    Type: Grant
    Filed: July 5, 1978
    Date of Patent: September 16, 1980
    Assignee: BBC Brown, Boveri & Company, Limited
    Inventors: Elmar Muller, Klaus Weimann
  • Patent number: 4141030
    Abstract: A high-power semiconductor assembly of the disk-cell construction has an insulating housing and exhibits electrical and thermal pressure-contacting of the semiconductor chip. At least two zones of different conduction types are provided within the chip and the same is clamped, in an essentially doubly symmetrical arrangement with respect to the mid-plane of the chip and the central axis perpendicular thereto, with the interposition of pressure plates, heat-conducting paste, and electrodes, particularly cup-shaped electrodes with their open sides disposed away from the main surfaces of the semiconductor chip, and between two terminal electrodes serving as heat sinks.
    Type: Grant
    Filed: December 16, 1976
    Date of Patent: February 20, 1979
    Assignee: BBC Brown Boveri & Company Limited
    Inventors: Dieter Eisele, Klaus Weimann