Patents by Inventor Klaus Wilke

Klaus Wilke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038621
    Abstract: Various embodiments of the teachings herein include an apparatus comprising: a component; a cooling element; and a connecting element arranged between the component and the cooling element to thermally couple the cooling element to the component. The connecting element comprises a porous connecting body including a metal material. Pores of the connecting body are at least in part filled with a filling material including a low-melting alloy or a fluorinated organic liquid.
    Type: Application
    Filed: October 29, 2021
    Publication date: February 1, 2024
    Applicant: Siemens Aktiengesellschaft
    Inventors: Jörg Strogies, Matthias Heimann, Bernd Müller, Klaus Wilke, Markus Pfeifer
  • Publication number: 20230215838
    Abstract: Various embodiments of the teachings herein include a method for joining and insulating a power electronic semiconductor component with contact surfaces to a substrate. In some embodiments, the method includes: preparing the substrate with a metallization defining an installation slot having joining material, wherein the substrate comprises an organic or a ceramic wiring support; arranging an electrically insulating film and the semiconductor component on the substrate, such that the contact surfaces of the semiconductor component facing the substrate are omitted from the film and regions of the semiconductor component exposed by the contact surfaces are insulated at least in part by the film from the substrate and from the contact surfaces; and joining the semiconductor component to the substrate and electrically insulating the semiconductor component at least in part by the film in one step.
    Type: Application
    Filed: May 19, 2021
    Publication date: July 6, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Bernd Müller, Christian Nachtigall-Schellenberg, Jörg Strogies, Klaus Wilke
  • Publication number: 20230189450
    Abstract: A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 15, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rene BLANK, Martin FRANKE, Peter FRUEHAUF, Ruediger KNOFE, Bernd MUELLER, Stefan NERRETER, Joerg STROGIES, Klaus WILKE
  • Patent number: 11564310
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 24, 2023
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20220336408
    Abstract: Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 20, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Nora Jeske, Bernd Müller, Christian Nachtigall-Schellenberg, Jörg Strogies, Klaus Wilke
  • Publication number: 20220285311
    Abstract: Various embodiments include a method for installing an electronic assembly having a die and a substrate with a reference plane. The method may include: providing a product carrier having recesses with varying dimensions different from one another; and arranging planar molded parts, joining materials, and the die on the product carrier. The die is in electrical contact with at least one planar molded part and at least one joining material. The method further includes forming functional elements from the planar molded parts and/or the die and the joining materials, the functional elements supporting the substrate and electrically contacting the reference plane.
    Type: Application
    Filed: June 15, 2020
    Publication date: September 8, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Matthias Heimann, Bernd Müller, Christian Nachtigall-Schellenberg, Jörg Strogies, Klaus Wilke
  • Patent number: 11424170
    Abstract: A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 23, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Nora Busche, Joerg Strogies, Klaus Wilke
  • Patent number: 11373984
    Abstract: Various embodiments include a power module comprising: a first power electronics device arranged on a first substrate board; and a second power electronics device mounted on a second substrate board. The first substrate board, the first device, the second substrate board, and the second device are arranged on a first baseplate stacked above one another or in planar fashion beside one another.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: June 28, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jörg Strogies, Klaus Wilke, Bernd Müller
  • Patent number: 11373804
    Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: June 28, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Publication number: 20220168851
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Patent number: 11331759
    Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: May 17, 2022
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
  • Patent number: 11289425
    Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 29, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Patent number: 11285569
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 29, 2022
    Assignees: Henkel AG & Co. KGaA, Heraeus Duetschland GmbH & Co. KG, Alpha Assembly Solutions Inc.
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Patent number: 11285568
    Abstract: Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: March 29, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jörg Strogies, Klaus Wilke, Christian Schellenberg
  • Patent number: 11282822
    Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: March 22, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Patent number: 11212918
    Abstract: Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: December 28, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Publication number: 20210351151
    Abstract: Various embodiments include a circuit carrier comprising: an installation place for an electronic component; and a deposit of a joining adjuvant applied to the installation place. The installation place has at an edge, a recess forming a depression in a surface of the circuit carrier. The deposit comprises a sintered material with a protuberance at an edge of the deposit.
    Type: Application
    Filed: August 20, 2019
    Publication date: November 11, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Robby Urbahn, Matthias Heimann, Christian Schellenberg, Klaus Wilke
  • Publication number: 20210242187
    Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
    Type: Application
    Filed: January 14, 2019
    Publication date: August 5, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Publication number: 20210176885
    Abstract: A backplane is for electrically connecting electrical components, and a method is for producing the backplane. The backplane includes a mounting board, conductor tracks arranged on the mounting board, and at least one sensor unit. The method includes integrating the at least one sensor unit into the mounting board by an additive manufacturing method; printing the conductor tracks from an electrically conductive paste, the electrically conductive paste being cured after being applied to the mounting board, by way of 3D printing; and detecting and monitoring, via the at least one sensor unit, function of the conductor tracks during production of the backplane.
    Type: Application
    Filed: April 15, 2019
    Publication date: June 10, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Dirk POEHLER, Joachim SEIDL, Klaus WILKE, Dieter STEINDL
  • Publication number: 20210161002
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Application
    Filed: March 20, 2019
    Publication date: May 27, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich