Abstract: In a method of coating substrates, especially printed circuit boards, on both sides, one side of the substrate, which is provided with holes, is coated by a coating process, especially by screen printing, wherein the holes that are not required for the circuit layout are lastingly covered over and the holes that are required are covered over only slightly or are left clear, whereupon the other side of the substrate is coated by a coating process, especially by curtain pouring or spraying, wherein the entire surface of the substrate is provided uniformly with a coating that gives only a light covering over the holes.

Abstract: A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence of one of a cathodic item and an anode, and an anodic item and a cathode, a surface of the item using means for reducing the thickness of a diffusion layer depleted in metal ions adjacent the surface of the item, which means include a wiping roller extending perpendicular to the transport direction over the entire width of the item and in contact with the item; and moving the electrolyte in a direction substantially perpendicular to a plane of the item so as to direct the electrolyte only toward the perforations in the item and to convey the electrolyte through the in the item under pressure.