Patents by Inventor Klay Kunkel
Klay Kunkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764086Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.Type: GrantFiled: July 8, 2022Date of Patent: September 19, 2023Assignee: LAM RESEARCH CORPORATIONInventors: David Trussell, John Daugherty, Christopher J. Pena, Michael C. Kellogg, Klay Kunkel, Richard H. Gould
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Publication number: 20220344183Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: David TRUSSELL, John DAUGHERTY, Christopher J. PENA, Michael C. KELLOGG, Klay KUNKEL, Richard H. GOULD
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Patent number: 11393705Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: GrantFiled: September 18, 2020Date of Patent: July 19, 2022Assignee: Lam Research CorporationInventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Publication number: 20210005485Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: ApplicationFiled: September 18, 2020Publication date: January 7, 2021Inventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Patent number: 10790174Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.Type: GrantFiled: April 12, 2018Date of Patent: September 29, 2020Assignee: LAM RESEARCH CORPORATIONInventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Publication number: 20180233387Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.Type: ApplicationFiled: April 12, 2018Publication date: August 16, 2018Inventors: John DAUGHERTY, David TRUSSELL, Michael KELLOGG, Christopher PENA, Richard H. GOULD, Klay KUNKEL
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Patent number: 10014196Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.Type: GrantFiled: October 20, 2015Date of Patent: July 3, 2018Assignee: LAM RESEARCH CORPORATIONInventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Patent number: 9929028Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: GrantFiled: October 18, 2016Date of Patent: March 27, 2018Assignee: Lam Research CorporationInventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20170110354Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20170110350Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: ApplicationFiled: October 18, 2016Publication date: April 20, 2017Inventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Patent number: 9502275Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: GrantFiled: October 20, 2015Date of Patent: November 22, 2016Assignee: Lam Research CorporationInventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel