Abstract: A display, including a carrying main body, a flexible carrier film, a double-sided tape, and an adhesive layer, is provided. The flexible carrier film includes a first bonding section and a second bonding section respectively disposed on two opposite sides of the carrying main body, and a bending section connected between the first bonding section and the second bonding section. The flexible carrier film has an inner surface and an outer surface opposite to each other. The inner surface has at least one first groove at the bending section. The flexible carrier film has a display layer thereon. At least a part of the display layer is connected to the outer surface at the second bonding section. The double-sided tape is disposed between the first bonding section and the carrying main body. The adhesive layer is disposed between the inner surface and the carrying main body at the bending section.

Abstract: A display apparatus includes a substrate, an element layer, a protective film, a mechanical member, a first adhesive layer and a second adhesive layer. An opening of the protective film is located between a first portion of the protective film and a second portion of the protective film. The first portion of the protective film, the second portion of the protective film and the opening of the protective film are respectively overlapped with a first portion of the substrate, a second portion of the substrate and a third portion of the substrate. The first adhesive layer and the second adhesive layer are respectively disposed on a first surface and a second surface of the mechanical member. The third portion of the substrate is connected between the first portion of the substrate and the second portion of the substrate, and the third portion of the substrate is bent.

Abstract: A display, including a carrying main body, a flexible carrier film, a double-sided tape, and an adhesive layer, is provided. The flexible carrier film includes a first bonding section and a second bonding section respectively disposed on two opposite sides of the carrying main body, and a bending section connected between the first bonding section and the second bonding section. The flexible carrier film has an inner surface and an outer surface opposite to each other. The inner surface has at least one first groove at the bending section. The flexible carrier film has a display layer thereon. At least a part of the display layer is connected to the outer surface at the second bonding section. The double-sided tape is disposed between the first bonding section and the carrying main body. The adhesive layer is disposed between the inner surface and the carrying main body at the bending section.

Abstract: A display apparatus includes a substrate, an element layer, a protective film, a mechanical member, a first adhesive layer and a second adhesive layer. An opening of the protective film is located between a first portion of the protective film and a second portion of the protective film. The first portion of the protective film, the second portion of the protective film and the opening of the protective film are respectively overlapped with a first portion of the substrate, a second portion of the substrate and a third portion of the substrate. The first adhesive layer and the second adhesive layer are respectively disposed on a first surface and a second surface of the mechanical member. The third portion of the substrate is connected between the first portion of the substrate and the second portion of the substrate, and the third portion of the substrate is bent.

Abstract: The invention discloses a remote hardware inspection system, including a remote monitor station and a client server. The monitor station includes a hardware inspection unit and a first network interface. The hardware inspection unit is for generating a hardware inspection command which is transmitted to the server by the first network interface. The server includes a second network interface, an input/output unit, and a managing/controlling unit. The input/output unit has an inspection program. The second network interface receives the hardware inspection command and transmits it to the managing/controlling unit. In response to the hardware inspection command, the managing/controlling unit generates and transmits a trigger signal to the input/output unit to implement the inspection program. Thereby, the inspection program writes data into the target hardware of the server according to the content of the hardware inspection command.

Abstract: The invention discloses a remote hardware inspection system, including a remote monitor station and a client server. The monitor station includes a hardware inspection unit and a first network interface. The hardware inspection unit is for generating a hardware inspection command which is transmitted to the server by the first network interface. The server includes a second network interface, an input/output unit, and a managing/controlling unit. The input/output unit has an inspection program. The second network interface receives the hardware inspection command and transmits it to the managing/controlling unit. In response to the hardware inspection command, the managing/controlling unit generates and transmits a trigger signal to the input/output unit to implement the inspection program. Thereby, the inspection program writes data into the target hardware of the server according to the content of the hardware inspection command.

Abstract: A wafer presence optical sensor system comprises a transfer chamber adapted to receive a wafer, an optical sensor comprising means emitting a sensing beam and means receiving a beam reflected from the wafer to ascertain wafer presence in the chamber, and means to reflect away the sensing beam when reaching a chamber bottom. The reflecting means includes an oblique area made in an inner surface of the chamber bottom or, alternatively, a body with an oblique area placed on the inner surface. Reflecting away the sensing beam when no wafer is present in the transfer chamber prevents the receiving means from receiving the beam reflected from the chamber bottom and thus thwarts the misinterpretation of wafer presence.

Abstract: A chemical vapor deposition (CVD) method for forming a microelectronic layer provides a source material dispensing nozzle employed within a chemical vapor deposition (CVD) apparatus which is employed within the chemical vapor deposition (CVD) method. The source material dispensing nozzle is calibrated to provide a calibrated source material dispensing nozzle. The calibrated source material dispensing nozzle is employed within the chemical vapor deposition (CVD) apparatus while employing the chemical vapor deposition (CVD) method for forming a chemical vapor deposition (CVD) deposited microelectronic layer upon the substrate positioned within the chemical vapor deposition (CVD) apparatus.

Abstract: An apparatus and a method for positioning a cassette pod onto a loadport by an overhead hoist transport system are described. The apparatus includes a vertical front panel of a process machine equipped with a docking opening therein, a loadport stage extending horizontally from the vertical front panel, a loadport situated on the loadport stage, at least two back guiding plates situated on the back of the loadport, at least two side guiding plates with one situated on each side of the loadport, a front guiding plate situated on the front side of the loadport, and a clamp positioner for guiding the position of an OHT clamp during an unloading operation of the cassette pod. The two halves of the clamp positioner move sideways away from each other to allow the cassette pod to pass therethrough during a loading operation.

Abstract: A wafer presence optical sensor system comprises a transfer chamber adapted to receive a wafer, an optical sensor comprising means emitting a sensing beam and means receiving a beam reflected from the wafer to ascertain wafer presence in the chamber, and means to reflect away the sensing beam when reaching a chamber bottom. The reflecting means includes an oblique area made in an inner surface of the chamber bottom or, alternatively, a body with an oblique area placed on the inner surface. Reflecting away the sensing beam when no wafer is present in the transfer chamber prevents the receiving means from receiving the beam reflected from the chamber bottom and thus thwarts the misinterpretation of wafer presence.

Abstract: An apparatus and a method for positioning a cassette pod onto a loadport by an overhead hoist transport system are described. The apparatus includes a vertical front panel of a process machine equipped with a docking opening therein, a loadport stage extending horizontally from the vertical front panel, a loadport situated on the loadport stage, at least two back guiding plates situated on the back of the loadport, at least two side guiding plates with one situated on each side of the loadport, a front guiding plate situated on the front side of the loadport, and a clamp positioner for guiding the position of an OHT clamp during an unloading operation of the cassette pod. The two halves of the clamp positioner move sideways away from each other to allow the cassette pod to pass therethrough during a loading operation.

Abstract: A method of calibrating a wafer edge gripping end effector. A wafer calibration tool is held in a stationary position simulating the position of a semiconductor wafer to be picked up by the wafer edge gripping end effector. A controller associated with a robot having an end effector attached to a robot arm thereto is turned off. The robot arm and end effector are moved to position where the first and second clamp structures on the end effector each engage a respective inner edge that in part defines a notch formed in the wafer calibration tool. An actuator driven movable clamp structure is manually advanced so that the movable clamp structure engages an inner edge that in part defines one of the notches formed in the wafer calibration tool. The controller is turned on and data regarding the location of robot arm, end effector and movable clamp structure is stored.

Abstract: Within a chemical vapor deposition (CVD) method for forming a microelectronic layer there is provided a source material dispensing nozzle employed within a chemical vapor deposition (CVD) apparatus which is employed within the chemical vapor deposition (CVD) method for forming the chemical vapor deposition (CVD) deposited microelectronic layer upon a substrate positioned within the chemical vapor deposition (CVD) apparatus. There is then calibrated the source material dispensing nozzle to provide a calibrated source material dispensing nozzle. There is then employed the calibrated source material dispensing nozzle within the chemical vapor deposition (CVD) apparatus while employing the chemical vapor deposition (CVD) method for forming the chemical vapor deposition (CVD) deposited microelectronic layer upon the substrate positioned within the chemical vapor deposition (CVD) apparatus.

Abstract: A method of calibrating a wafer edge gripping end effector. A wafer calibration tool is held in a stationary position simulating the position of a semiconductor wafer to be picked up by the wafer edge gripping end effector. A controller associated with a robot having an end effector attached to a robot arm thereto is turned off. The robot arm and end effector are moved to position where the first and second clamp structures on the end effector each engage a respective inner edge that in part defines a notch formed in the wafer calibration tool. An actuator driven movable clamp structure is manually advanced so that the movable clamp structure engages an inner edge that in part defines one of the notches formed in the wafer calibration tool. The controller is turned on and data regarding the location of robot arm, end effector and movable clamp structure is stored.