Patents by Inventor KO-CHUN WU

KO-CHUN WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATABLE DIE UNIT AND PROBE SEAT USING THE SAME
    Publication number: 20220214380
    Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, KO-CHUN WU