Abstract: An object of the present invention is to provide a conductive resin composition that achieves low volume resistivity and thus exhibits good conductivity when formed into a conductive film, offers good adhesion to various types of base materials, and demonstrates excellent storage stability, and therefore proves useful as a conductive ink, circuit connection material, etc. As a solution, a conductive resin composition is provided that contains: (a) one or more types of conductive powders selected from the group consisting of silver-based metal powders, copper-based metal powders, aluminum-based metal powders, iron-based metal powders, nickel-based metal powders, zinc-based metal powders, tin-based metal powders, and gold-based metal powders; and (b) a polyvinyl butyral-based resin; and also contains (c) a resol-type phenol-based resin by 0 to 75 parts by mass relative to 100 parts by mass of polyvinyl butyral-based resin.

Abstract: An antimicrobial laminate excelling in the ability to effect gradual release of an antimicrobial agent and providing an antimicrobial action evenly and bags and other containers using the antimicrobial laminate are disclosed. A substratal film 24 impervious to steam is provided on one side of a substratal film proper 22 of paper with a gas-barriering layer 23 of aluminum foil. An antimicrobial film 21a pervious to steam is formed by sequentially superposing an adhesive agent layer (AITC regenerating layer) 16a containing an AITC inclusion cyclodextrin compound 15 (fine powder), a steam-pervious film 17a having a fine powder of silica gel dispersed therein, an adhesive agent layer 16b identical in construction with the adhesive agent layer 16a, and a sealant material 17b of steam-pervious film in the order mentioned. An antimicrobial layer 121 is constructed by adhesively superposing the substratal film 24 and the antimicrobial film 21a through the medium of the adhesive agent layer 16a.