Patents by Inventor Ko Higashitani

Ko Higashitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10589234
    Abstract: Embodiments provide a wet disperser for dispersing particulates in a mixture containing at least a dispersing medium and particulates. According to various embodiments, the wet disperser includes a through channel extending from an inflow port to an outflow port, and a mixture-passing plate having at least one passing hole defined. In the wet disperser, the through channel includes, on a downstream side of the through channel from a position provided with the mixture-passing plate, a dispersion part having a vibration body provided such that vibration causes at least a part of the vibration body to come into contact with at least a part of an opening periphery of the passing hole, and an inside surface defining the passing hole of the mixture-passing plate.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 17, 2020
    Assignee: OHKAWARA KAKOHKI CO., LTD.
    Inventors: Ko Higashitani, Masaaki Ohkawara, Tomonao Ohkawara, Takayuki Tanaka, Toshiyuki Koganei
  • Publication number: 20180193809
    Abstract: Embodiments provide a wet disperser for dispersing particulates in a mixture containing at least a dispersing medium and particulates. According to various embodiments, the wet disperser includes a through channel extending from an inflow port to an outflow port, and a mixture-passing plate having at least one passing hole defined. In the wet disperser, the through channel includes, on a downstream side of the through channel from a position provided with the mixture-passing plate, a dispersion part having a vibration body provided such that vibration causes at least a part of the vibration body to come into contact with at least a part of an opening periphery of the passing hole, and an inside surface defining the passing hole of the mixture-passing plate.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 12, 2018
    Applicant: OHKAWARA KAKOHKI CO., LTD.
    Inventors: Ko HIGASHITANI, Masaaki OHKAWARA, Tomonao OHKAWARA, Takayuki TANAKA, Toshiyuki KOGANEI
  • Patent number: 9125315
    Abstract: To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: September 1, 2015
    Assignees: Kyoto University, SANYO CHEMICAL INDUSTRIES, LTD., Mitsubishi Rayon Co., Ltd.
    Inventors: Ko Higashitani, Yasuhiro Tsudo, Masaki Nakayama, Shinji Kake
  • Publication number: 20120325545
    Abstract: To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
    Type: Application
    Filed: January 18, 2011
    Publication date: December 27, 2012
    Applicants: Kyoto University, Mitsubishi Rayon Co., Ltd., SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Ko Higashitani, Yasuhiro Tsudo, Masaki Nakayama, Shinji Kake