Patents by Inventor Ko Kishida

Ko Kishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4754319
    Abstract: In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.
    Type: Grant
    Filed: September 11, 1987
    Date of Patent: June 28, 1988
    Assignees: Kabushiki Kaisha Toshiba, Shoei Printing Company Limited
    Inventors: Tamio Saito, Masayuki Ohuchi, Hirosi Oodaira, Yoshikatsu Fukumoto, Shuji Hiranuma, Ko Kishida, Takanori Kisaka