Abstract: A wireless communication device includes a processor, a memory unit capable of retaining data in a power saving state, a clock control unit configured to control when a clock is to be supplied to each pair of processor and memory, and a power control unit configured to control an amount of power to be supplied to the processor and the memory unit. In the power saving state, the clock control unit stops supplying the clock to the processor and the memory unit, and the power control unit reduces the amount of power supplied to the memory unit. When returning from the power saving state, the power control unit increases the amount of power supplied to the memory unit, and the clock control unit starts supplying the clock to the memory unit before starting to supply the clock to the processor.

Abstract: A wireless communication device includes a processor, a memory unit capable of retaining data in a power saving state, a clock control unit configured to control when a clock is to be supplied to each pair of processor and memory, and a power control unit configured to control an amount of power to be supplied to the processor and the memory unit. In the power saving state, the clock control unit stops supplying the clock to the processor and the memory unit, and the power control unit reduces the amount of power supplied to the memory unit. When returning from the power saving state, the power control unit increases the amount of power supplied to the memory unit, and the clock control unit starts supplying the clock to the memory unit before starting to supply the clock to the processor.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.