Abstract: Disclosed is a photoelectric conversion element including a cell. The cell includes a first electrode, a second electrode, an oxide semiconductor layer provided on the first electrode, and an electrolyte provided between the first and second electrodes. The second electrode includes an annular portion, an approaching portion approaching the oxide semiconductor layer closer than the annular portion and an annular connecting portion connecting the annular portion and the approaching portion, and the oxide semiconductor layer includes an inner part facing the approaching portion on the first electrode and an annular outer part provided around the inner part and facing the connecting portion. The outer part includes a plurality of linear portions separated from one another and a corner portion connecting two adjacent linear portions to each other, the corner portion is thicker than the linear portion, and the linear portion is thicker than the inner part.

Abstract: A dye-sensitized photoelectric conversion element including a cell is disclosed. The cell includes a conductive substrate and a transparent conductive layer, a counter substrate facing the conductive substrate and including a metal substrate, a semiconductor layer provided on the conductive substrate, a sealing portion bonding the conductive and the counter substrates, a connecting portion connecting one end of a wiring material and the metal substrate, and a portion to be connected which is connected to the other end of the wiring material, the connecting portion contains first conductive particles, a filler, and a binder resin, the wiring material contains second conductive particles and a binder resin, an average particle diameter of the first conductive particles is greater than that of the filler in the connecting portion, and a content rate of the filler in the connecting portion is greater than that of the filler in the wiring material.

Abstract: A photoelectric conversion element includes a cell which includes a pair of substrates, an oxide semiconductor layer provided on one of the substrates, an electrolyte provided between the substrates, and a sealing portion joining the substrates. At least one of the substrates includes a joining portion joined to the sealing portion and a non-joining portion present inside the joining portion and not joined to the sealing portion. The joining portion includes first linear portions spaced apart from each other, and a first connecting portion connecting two first linear portions among the first linear portions. Additionally, the first connecting portion is formed by cutting off a whole corner portion on an opposite side from the non-joining portion in a first intersecting portion formed by extending and crossing the two first linear portions along a thickness direction of the substrates when the substrates are viewed in the thickness direction thereof.

Abstract: Disclosed is a photoelectric conversion element including a cell. The cell includes a first electrode, a second electrode, an oxide semiconductor layer provided on the first electrode, and an electrolyte provided between the first and second electrodes. The second electrode includes an annular portion, an approaching portion approaching the oxide semiconductor layer closer than the annular portion and an annular connecting portion connecting the annular portion and the approaching portion, and the oxide semiconductor layer includes an inner part facing the approaching portion on the first electrode and an annular outer part provided around the inner part and facing the connecting portion. The outer part includes a plurality of linear portions separated from one another and a corner portion connecting two adjacent linear portions to each other, the corner portion is thicker than the linear portion, and the linear portion is thicker than the inner part.

Abstract: A dye-sensitized photoelectric conversion element including a cell is disclosed. The cell includes a conductive substrate and a transparent conductive layer, a counter substrate facing the conductive substrate and including a metal substrate, a semiconductor layer provided on the conductive substrate, a sealing portion bonding the conductive and the counter substrates, a connecting portion connecting one end of a wiring material and the metal substrate, and a portion to be connected which is connected to the other end of the wiring material, the connecting portion contains first conductive particles, a filler, and a binder resin, the wiring material contains second conductive particles and a binder resin, an average particle diameter of the first conductive particles is greater than that of the filler in the connecting portion, and a content rate of the filler in the connecting portion is greater than that of the filler in the wiring material.