Abstract: A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.

Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.

Abstract: A method for switch dual Id verification systems for installing another carrier ID system on an equipment installation complying with SEMI E87. A first identification access system has internally installed on an equipment installation on which a second identification access system is then installed. Both systems are switched using a control flow and a wafer carrier ID is obtained by the chosen verification system.

Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.

Abstract: A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.

Abstract: A transport system within a fabrication system. The fabrication system contains a plurality of tool bays, each of which has a plurality of processing tools for processing articles. The transport system contains a plurality of intrabay transport subsystems, an interbay transport subsystem, a plurality of stockers, and at least one linking subsystem. Each intrabay transport subsystem is dedicated to transporting articles within a particular tool bay. The interbay transport subsystem, linking the tool bays, transports articles between the tool bays. The stockers, located between the intrabay and interbay transport subsystems, store articles between processing and transfer articles between the intrabay and interbay transport subsystems. The linking subsystem, located between two adjacent intrabay transport subsystems, provides direct transport between the two corresponding tool bays.

Abstract: A transport system within a fabrication system. The fabrication system contains a plurality of tool bays, each of which has a plurality of processing tools for processing articles. The transport system contains a plurality of intrabay transport subsystems, an interbay transport subsystem, a plurality of stockers, and at least one linking subsystem. Each intrabay transport subsystem is dedicated to transporting articles within a particular tool bay. The interbay transport subsystem, linking the tool bays, transports articles between the tool bays. The stockers, located between the intrabay and interbay transport subsystems, store articles between processing and transfer articles between the intrabay and interbay transport subsystems. The linking subsystem, located between two adjacent intrabay transport subsystems, provides direct transport between the two corresponding tool bays.

Abstract: A method for switch dual Id verification systems for installing another carrier ID system on an equipment installation complying with SEMI E87. A first identification access system has internally installed on an equipment installation on which a second identification access system is then installed. Both systems are switched using a control flow and a wafer carrier ID is obtained by the chosen verification system.

Abstract: The present invention provides an automated material handling system (AMHS) having: a FOUP management system, for managing a plurality of multiple lot FOUPs; a real time dispatch system for controlling dispatching of wafer lot orders within a wafer fabrication system; an automatic material handling integration system having a stocker for storing and sequencing a plurality of FOUPs, the stocker having an embedded sorter disposed there within for sorting wafers within a plurality of multiple lot FOUPs, and a FOUP transportation system for transporting FOUPs within a wafer fabrication facility; a manufacture execution system in operative communication with the real time dispatch system for controlling recipe processing and for controlling flow of FOUPs within the FAB; and a computer integrated manufacturing system for automating equipment within the AMHS. Additionally provided is a methodology for using the embedded sorter to sort FOUPs and a plurality of wafers within the AMHS.

Abstract: The present invention provides an automated material handling system (AMHS) having: a FOUP management system, for managing a plurality of multiple lot FOUPs; a real time dispatch system for controlling dispatching of wafer lot orders within a wafer fabrication system; an automatic material handling integration system having a stocker for storing and sequencing a plurality of FOUPs, the stocker having an embedded sorter disposed there within for sorting wafers within a plurality of multiple lot FOUPs, and a FOUP transportation system for transporting FOUPs within a wafer fabrication facility; a manufacture execution system in operative communication with the real time dispatch system for controlling recipe processing and for controlling flow of FOUPs within the FAB; and a computer integrated manufacturing system for automating equipment within the AMHS. Additionally provided is a methodology for using the embedded sorter to sort FOUPs and a plurality of wafers within the AMHS.