Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.

Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.

Abstract: The present invention provides a method of combining heat pipes and fins and the assembly thereof. The fins are stacked, each of which has holes, extending walls around the holes, lateral plates beside the extending walls to form a receiving portion therein communicated with a first opening of the extending wall respectively. The fins are placed with the receiving portions under the holes first. A solder material is injected into the receiving portions by a needle. The heat pipes are inserted into the holes of the fins, and then the fins are tipped over to have the receiving portions above the holes. Now the fins are heated to melt the solder material, and the molten solder material will flow to spaces between the heat pipe and the extending walls of the fins to fix the heat pipes to the fins.

Abstract: A method of combination of a heat pipe and a heat sink includes the steps of preparing a heat sink and a heat pipe, wherein the heat sink has an insertion hole in which the heat sink is inserted; placing the heat sink and the heat pipe onto a carrier, wherein a pressing member is located over the carrier, and a convexity corresponds to the insertion hole; punching the heat sink with the pressing member by punching the insertion hole with the convexity to cause deformation of the sidewall of the insertion hole between the heat pipe and the heat sink, whereby the heat pipe is tightly fitted in the insertion hole; and removing the pressing member from the heat sink to complete the combination of the heat pipe and the heat sink.

Abstract: A heat-dissipating module is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe which is U-shaped includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.