Patents by Inventor Ko-Wei Chang
Ko-Wei Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145403Abstract: An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.Type: ApplicationFiled: February 6, 2023Publication date: May 2, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chih-Chiang HE, Ko-Wei CHANG, Chia-Yang CHEN
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Publication number: 20240131538Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.Type: ApplicationFiled: December 8, 2022Publication date: April 25, 2024Inventors: CHEN-CHUNG DU, Ming-Jyh Chang, Chang-Yi Chen, Ming-Hau Tsai, Ko-Chieh chao, Yi-Wei Lin
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Publication number: 20240047440Abstract: An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.Type: ApplicationFiled: September 29, 2022Publication date: February 8, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wen-Jung Tsai, Chih-Hsien Chiu, Chin-Chiang He, Ko-Wei Chang, Chien-Cheng Lin
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Publication number: 20230282972Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.Type: ApplicationFiled: May 19, 2022Publication date: September 7, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Shao-Tzu Tang, Chih-Hsien Chiu, Wen-Jung Tsai, Ko-Wei Chang, Chia-Chu LAI
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Publication number: 20230223322Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.Type: ApplicationFiled: January 13, 2022Publication date: July 13, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
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Publication number: 20230154873Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.Type: ApplicationFiled: January 17, 2023Publication date: May 18, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei CHANG
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Publication number: 20230154872Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.Type: ApplicationFiled: January 17, 2023Publication date: May 18, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei CHANG
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Patent number: 11587892Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.Type: GrantFiled: January 27, 2021Date of Patent: February 21, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei Chang
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Publication number: 20230027120Abstract: An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.Type: ApplicationFiled: August 25, 2021Publication date: January 26, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Shao-Tzu Tang, Wen-Jung Tsai, Chih-Hsien Chiu, Ko-Wei Chang, Yu-Wei Yeh, Yu-Cheng Pai, Chuan-Yi Pan, Chi-Rui Wu
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Publication number: 20220093538Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.Type: ApplicationFiled: January 27, 2021Publication date: March 24, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei CHANG
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Patent number: 9086406Abstract: The present invention provides a Hemoglobin A1c-specific aptamer and a Hemoglobin-specific aptamer. The aptamers were selected in vitro using SELEX and a microfluidic chip system. The aptamers established low free energy, thus were more stable than conventional antibodies. The high specificity of the aptamers to Hemoglobin A1c or Hemoglobin allows them to be effectively used in diagnosis of diabetes and/or anemia.Type: GrantFiled: March 25, 2014Date of Patent: July 21, 2015Assignee: NATIONAL TSING HUA UNIVERSITYInventors: Gwo-Bin Lee, Shu-Chu Shiesh, Ching-Chu Wu, Hsin-I Lin, Ko-Wei Chang
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Publication number: 20150111306Abstract: The present invention provides a Hemoglobin A1c-specific aptamer and a Hemoglobin-specific aptamer. The aptamers were selected in vitro using SELEX and a microfluidic chip system. The aptamers established low free energy, thus were more stable than conventional antibodies. The high specificity of the aptamers to Hemoglobin A1c or Hemoglobin allows them to be effectively used in diagnosis of diabetes and/or anemia.Type: ApplicationFiled: March 25, 2014Publication date: April 23, 2015Applicant: National Tsing Hua UniversityInventors: Gwo-Bin Lee, Shu-Chu Shiesh, Ching-Chu Wu, Hsin-I Lin, Ko-Wei Chang
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Patent number: 7173755Abstract: A high-efficiency multiple-pass nonlinear wavelength converter and amplitude modulator employs a variable dispersion element between adjacent passes of a nonlinear wavelength conversion process in a single nonlinear optical material substrate. When controlled by a voltage via the electro-optic effect, the variable dispersion element dynamically alters the phase matching condition of the multiple-pass nonlinear wavelength conversion process and thus modulates the laser output amplitude. When the phase mismatch between passes is completely compensated by the variable dispersion element, the multiple-pass nonlinear wavelength converter achieves its maximum efficiency.Type: GrantFiled: December 20, 2004Date of Patent: February 6, 2007Assignee: National Tsing Hua UniversityInventors: Yen-Chien Huang, Yen-Hung Chen, An-Chung Chiang, Ko-Wei Chang
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Publication number: 20050134958Abstract: A high-efficiency multiple-pass nonlinear wavelength converter and amplitude modulator employs a variable dispersion element between adjacent passes of a nonlinear wavelength conversion process in a single nonlinear optical material substrate. When controlled by a voltage via the electro-optic effect, the variable dispersion element dynamically alters the phase matching condition of the multiple-pass nonlinear wavelength conversion process and thus modulates the laser output amplitude. When the phase mismatch between passes is completely compensated by the variable dispersion element, the multiple-pass nonlinear wavelength converter achieves its maximum efficiency.Type: ApplicationFiled: December 20, 2004Publication date: June 23, 2005Applicant: National Tsing Hua UniversityInventors: Yen-Chien Huang, Yen-Hung Chen, An-Chung Chiang, Ko-Wei Chang