Patents by Inventor Ko-Wen Chen

Ko-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHING METHOD
    Publication number: 20240383094
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and at least one detection window. The at least one detection window is located in the polishing layer. The at least one detection window includes a center portion and a cover portion surrounding the center portion. The cover portion is joined to the polishing layer, and a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00.
    Type: Application
    Filed: May 13, 2024
    Publication date: November 21, 2024
    Applicant: IV Technologies CO., Ltd.
    Inventor: Ko-Wen Chen
  • Polishing pad, polishing system and polishing method
    Patent number: 10040167
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: August 7, 2018
    Assignee: IV Technologies CO., Ltd.
    Inventors: Ko-Wen Chen, Shih-Ming Yu
  • POLISHING PAD, POLISHING SYSTEM AND POLISHING METHOD
    Publication number: 20170036319
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.
    Type: Application
    Filed: August 1, 2016
    Publication date: February 9, 2017
    Applicant: IV Technologies CO., Ltd.
    Inventors: Ko-Wen Chen, Shih-Ming Yu