Patents by Inventor Kock Hien Wee

Kock Hien Wee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating leadframe-mounted integrated circuits
    Patent number: 6808661
    Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: October 26, 2004
    Assignee: ASM Technology Singapore PTE Ltd.
    Inventors: See Yap Ong, Kock Hien Wee, Shu Chuen Ho, Teng Hock Kuah, Jian Wu
  • Methods and apparatus for cleaning an IC encapsulation system
    Publication number: 20030107142
    Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the moulds. To reduce the level of dust which enters the moulding region, the path along which the leadframe items are conveyed to the moulding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the moulding region under a cover including a vacuum source, so that the dust is continually sucked away from them.
    Type: Application
    Filed: December 11, 2001
    Publication date: June 12, 2003
    Applicant: ASM Technology Singapore Pte Ltd.
    Inventors: See Yap Ong, Kock Hien Wee, Shu Chuen Ho, Teng Hock Kuah, Jian Wu