Patents by Inventor Kock Khuen SEET

Kock Khuen SEET has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MANUFACTURING METHOD OF PROCESSED RESIN SUBSTRATE AND LASER PROCESSING APPARATUS
    Publication number: 20220241901
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Application
    Filed: April 18, 2022
    Publication date: August 4, 2022
    Inventors: Kock Khuen SEET, Masayuki HAYASHIDA, Masakazu SAKAMOTO, Hiroto TAMAKI
  • Manufacturing method of processed resin substrate and laser processing apparatus
    Patent number: 11338393
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: May 24, 2022
    Assignees: LASER SYSTEMS INC., NICHIA CORPORATION
    Inventors: Kock Khuen Seet, Masayuki Hayashida, Masakazu Sakamoto, Hiroto Tamaki
  • MANUFACTURING METHOD OF PROCESSED RESIN SUBSTRATE AND LASER PROCESSING APPARATUS
    Publication number: 20170120390
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Application
    Filed: October 28, 2016
    Publication date: May 4, 2017
    Inventors: Kock Khuen SEET, Masayuki HAYASHIDA, Masakazu SAKAMOTO, Hiroto TAMAKI