Patents by Inventor Kock Lee

Kock Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro lead frame package having transparent encapsulant
    Publication number: 20050146057
    Abstract: The present invention discloses an MLP having an optically transparent encapsulant. The MLP comprises a lead frame having a die-pad, a plurality of lead fingers and an interlock undercut. A die is placed onto the die-pad. A conductive wire is provided for connecting the die to the plurality of lead finger. The package is then encapsulated using optically transparent encapsulant.
    Type: Application
    Filed: June 17, 2004
    Publication date: July 7, 2005
    Inventors: Ah Khor, Kock Lee, Boon Chan, Min Thum, Hong Tung, Mun Cheong