Abstract: A lamination device that laminates a plurality of types of workpieces includes a plurality of supply mechanisms that supply a workpiece to each of a plurality of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a control unit that controls at least the mover. The mover includes a lamination stage for laminating the workpiece. The control unit corrects a relative position of the workpiece supplied to the supply positions with respect to the lamination stage, laminates the workpiece whose relative position is corrected on the lamination stage, and controls the mover so as to move to a next one of the supply positions after lamination of the workpiece.

Abstract: A lamination device that laminates a plurality of types of workpieces includes supply mechanisms that supply the workpiece to each of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a controller that controls at least the mover. The mover includes a holding unit that holds the workpiece supplied to the supply positions, and a lamination stage for lamination the workpiece. The controller corrects a relative position of the workpiece with respect to the lamination stage and controls the mover to laminate the workpiece whose relative position is corrected on the lamination stage while the holding unit holds the workpiece supplied to the supply positions and moves to and stops at a next one of the supply positions.

Abstract: A lamination device that laminates a plurality of types of workpieces includes a plurality of supply mechanisms that supply a workpiece to each of a plurality of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a control unit that controls at least the mover. The mover includes a lamination stage for laminating the workpiece. The control unit corrects a relative position of the workpiece supplied to the supply positions with respect to the lamination stage, laminates the workpiece whose relative position is corrected on the lamination stage, and controls the mover so as to move to a next one of the supply positions after lamination of the workpiece.

Abstract: A source electrode (5) and a drain electrode (6) are film-formed, and a semiconductor layer (7) is formed in a substantially stripe shape substantially parallel to the X axis direction (channel-length direction) using a coating method. Then, a protection layer (8) is formed in a substantially stripe shape substantially parallel to the Y axis direction (channel width direction) orthogonal to the semiconductor layer (7). Then, a semiconductor layer (7) portion not covered with the protection layer (8) is removed using an organic solvent or an inorganic solvent or a mixed solution of the organic solvent and the inorganic solvent. Consequently, the semiconductor layer (7) and the protection layer (8) are formed with improved alignment accuracy, and electrical isolation between transistor elements (50) can be achieved with a simplified process.

Abstract: A source electrode (5) and a drain electrode (6) are film-formed, and a semiconductor layer (7) is formed in a substantially stripe shape substantially parallel to the X axis direction (channel-length direction) using a coating method. Then, a protection layer (8) is formed in a substantially stripe shape substantially parallel to the Y axis direction (channel width direction) orthogonal to the semiconductor layer (7). Then, a semiconductor layer (7) portion not covered with the protection layer (8) is removed using an organic solvent or an inorganic solvent or a mixed solution of the organic solvent and the inorganic solvent. Consequently, the semiconductor layer (7) and the protection layer (8) are formed with improved alignment accuracy, and electrical isolation between transistor elements (50) can be achieved with a simplified process.

Abstract: A method for fabricating a thin-film transistor is provided whereby isolation of transistor devices is realized and the performance and the stability of the product thin-film transistor are improved. The thin-film transistor includes a substrate; a gate electrode laminated on the substrate; a gate insulating layer laminated on the substrate and the gate electrode; a recessed portion provided in the gate insulating layer; a semiconductor layer formed in the recessed portion of the gate insulating layer; and a source electrode and a drain electrode connected to the semiconductor layer at respective positions which are spaced apart from each other.

Abstract: One embodiment of the present invention is a thin film transistor having a substrate, a gate electrode formed on the substrate, a gate insulating film, a semiconductor layer formed on the gate insulating film, a protective film formed on the semiconductor layer and the gate insulating film and having first and second opening sections which are separately and directly formed on the semiconductor layer, a source electrode formed on the protective film and electrically connected to the semiconductor layer at the first opening section of the protective film, and a drain electrode formed on the protective film and electrically connected to the semiconductor layer at the second opening section of the protective film.

Abstract: One embodiment of the present invention is a thin film transistor having a substrate, a gate electrode formed on the substrate, a gate insulating film, a semiconductor layer formed on the gate insulating film, a protective film formed on the semiconductor layer and the gate insulating film and having first and second opening sections which are separately and directly formed on the semiconductor layer, a source electrode formed on the protective film and electrically connected to the semiconductor layer at the first opening section of the protective film, and a drain electrode formed on the protective film and electrically connected to the semiconductor layer at the second opening section of the protective film.