Patents by Inventor Kodai OKOSHI

Kodai OKOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition, semiconductor sealing agent, and semiconductor device
    Patent number: 10196513
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: February 5, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Tomoya Yamazawa, Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe
  • Epoxy resin composition, semiconductor sealing agent, and semiconductor device
    Patent number: 9947604
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: April 17, 2018
    Assignee: NAMICS CORPORATION
    Inventors: Kazuyuki Kohara, Tomoya Yamazawa, Kodai Okoshi, Nobuyuki Abe
  • EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
    Publication number: 20170022356
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 26, 2017
    Inventors: Tomoya YAMAZAWA, Kazuyuki KOHARA, Kodai OKOSHI, Nobuyuki ABE
  • EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
    Publication number: 20170005021
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 5, 2017
    Inventors: Kazuyuki KOHARA, Tomoya YAMAZAWA, Kodai OKOSHI, Nobuyuki ABE