Patents by Inventor Kodo Kishida

Kodo Kishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure-sensitive adhesive tape for fixing a joint portion and method of using the same
    Patent number: 6849057
    Abstract: A pressure-sensitive adhesive tape for fixing a joint portion includes a support of a generally rectangular shape having a longer side and a shorter side and a pressure sensitive adhesive layer on one side of the support in at least a portion thereof. The support is provided with a non-adherent portion or a weakly adherent portion. The tape has a cut line extending from an end of the shorter side to near the non-adherent or weakly adherent portion.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: February 1, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Hideo Satou, Masayuki Konno, Kodo Kishida, Yoshitada Morikawa, Osamu Oohira, Seishi Suzuki, Yuichi Inoue
  • Pressure-sensitive adhesive tape for fixing a joint portion and method of using the same
    Publication number: 20030069530
    Abstract: A pressure-sensitive adhesive tape for fixing a joint portion includes a support of a generally rectangular shape having a longer side and a shorter side and a pressure sensitive adhesive layer on one side of the support in at least a portion thereof. The support is provided with a non-adherent portion or a weakly adherent portion. The tape has a cut line extending from an end of the shorter side to near the non-adherent or weakly adherent portion.
    Type: Application
    Filed: May 8, 2002
    Publication date: April 10, 2003
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hideo Satou, Masayuki Konno, Kodo Kishida, Yoshitada Morikawa, Osamu Oohira, Seishi Suzuki, Yuichi Inoue