Abstract: Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment. Embodiments offer the ability to maintain the working fluid at a constant temperature.

Abstract: Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment.

Abstract: A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 20 comprises: a first pin electronics card 21; a second pin electronics card 22; and a single intermediate water jacket 23 which is sandwiched between the first pin electronics card 21 and second pin electronics card 22. The intermediate water jacket 23 is in close contact with the first inside main surface 212 of the first pin electronics card 21 which faces the second pin electronics card 22 and is in close contact with the second inside main surface 222 of the second pin electronics card 22 which faces the first pin electronics card 21.

Abstract: A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM.

Abstract: A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 20 comprises: a first pin electronics card 21; a second pin electronics card 22; and a single intermediate water jacket 23 which is sandwiched between the first pin electronics card 21 and second pin electronics card 22. The intermediate water jacket 23 is in close contact with the first inside main surface 212 of the first pin electronics card 21 which faces the second pin electronics card 22 and is in close contact with the second inside main surface 222 of the second pin electronics card 22 which faces the first pin electronics card 21.

Abstract: It is an object to use an additional circuit to increase speed and functioning of an existing test apparatus at a low cost. Provided is a test apparatus that is connected to a socket board corresponding to a type of device under test and tests the device under test. The test apparatus comprises a test head including therein a test module that tests the device under test; a function board that is connected to the test module in the test head via a cable and also connected to the socket board; and an additional circuit that is loaded on the function board and connected to the test module and the device under test.

Abstract: A heat sink structure having an improved heat radiation efficiency is disclosed. The heat sink structure comprises a plate-shaped heat sink having a top surface and a bottom surface, wherein through holes along a planar direction of a board are formed between the top surface and the bottom surface of the heat sink.

Abstract: A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first cover covering only the measurement device among the plurality of devices, and a second cover covering only the power device among the plurality of devices. The first cover and the second cover are electrically insulated from each other.

Abstract: A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM.

Abstract: To provide a heat sink structure able to improve the heat radiation efficiency without thickening of the heat sink. A heat sink structure comprises a plate-shaped heat sink 40 having a top surface 41 and a bottom surface 42, wherein through holes 43 to 45 along a planar direction of a board 21 are formed between the top surface 41 and the bottom surface 42 of the heat sink 40.

Abstract: A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first cover covering only the measurement device among the plurality of devices, and a second cover covering only the power device among the plurality of devices. The first cover and the second cover are electrically insulated from each other.

Abstract: There is provided a heat transferring object for transferring heat generated by a object to be cooled to a cooling unit, having a plurality of thermal transferring plates each having elasticity and provided in lamination and adhesive materials having thermal conductivity and provided between the thermal transferring plates so as to slidably hold the thermal transferring plates. Preferably, each of the thermal transferring plates has almost the same shape. Each of the thermal transferring plates may have a cooling unit fixing portion to be secured to the cooling unit and a plurality of extensions extending respectively from the cooling unit fixing portion and secured to the objects to be cooled independently from each other.

Abstract: There is provided a heat transferring object for transferring heat generated by a object to be cooled to a cooling unit, having a plurality of thermal transferring plates each having elasticity and provided in lamination and adhesive materials having thermal conductivity and provided between the thermal transferring plates so as to slidably hold the thermal transferring plates. Preferably, each of the thermal transferring plates has almost the same shape. Each of the thermal transferring plates may have a cooling unit fixing portion to be secured to the cooling unit and a plurality of extensions extending respectively from the cooling unit fixing portion and secured to the objects to be cooled independently from each other.

Abstract: A heating element cooling cover 5 for covering IC devices 44 mounted on a substrate 4, wherein a coolant is circulated to be able to contact the IC devices 44, and a groove 54 (bypath) is provided for an air and the coolant to flow from a gas accumulation part where gas accumulation is liable to be generated inside the heat element cooling cover 5 to a position where the circulating coolant comes downstream of the gas accumulation portion, so that gas accumulation can be effectively removed as a result that the air in the gas accumulation part can pass through the bypath.

Abstract: A heating element cooling cover 5 for covering IC devices 44 mounted on a substrate 4, wherein a coolant is circulated to be able to contact the IC devices 44, and a groove 54 (bypath) is provided for an air and the coolant to flow from a gas accumulation part where gas accumulation is liable to be generated inside the heat element cooling cover 5 to a position where the circulating coolant comes downstream of the gas accumulation portion, so that gas accumulation can be effectively removed as a result that the air in the gas accumulation part can pass through the bypath.