Abstract: A solid-state imaging device includes a wafer substrate having photoelectric conversion elements, a filter part formed on the wafer substrate and having color filters positioned in correspondence with the photoelectric conversion elements, and a microlens part including a non-photosensitive resin and having microlenses positioned in correspondence with the color filters. The microlenses are positioned with a gap between two microlenses adjacent to each other in a diagonal direction of a square region in which the color filters are positioned and with a gap between two microlenses adjacent to each other in a direction in which a side of the square region extends.