Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.

Abstract: A pick and place machine is described which uses an imprint left in a layer of fluid by a component that has been dipped in the fluid to guide a placement process. An apparatus for placing a component is disclosed, which includes a surface that receives a layer of fluid, an imprint of a component in the layer of fluid, and a camera that captures an image of the imprint in the fluid. A method of placing a component with a pick and place machine is disclosed which includes dipping a component in a layer of fluid, capturing an image of the layer of fluid, analyzing the image of the layer of fluid, and placing the component based on results of the analysis of the image of the layer of fluid. The image can be used to determine the status of the component or where to place the component.

Abstract: A component placement machine that includes a movable housing that is adapted for movement in an X and a Y axis above a printed circuit board. The housing includes a rotatable frame having at least one pick and place head configured to pick up a component and place the component on the printed circuit board. The housing further includes a fluid application station configured to apply fluid to the component after being picked up by the pick and place head and before being placed on the printed circuit board.

Abstract: A spindle assembly drive system that includes a rack unit, a drive gear, a motor, and a plurality of bearings, such that said rack unit laterally moves in a first axis with little or no movement in or rotation about any other axis.

Abstract: The present invention features a method whereby each vacuum nozzle in a multi-spindle component placement machine is inspected placement cycle. This process also allows for updating calibration of the nozzle position as well as immediate feedback regarding the condition of the vacuum nozzle. A chipped orifice or otherwise damaged nozzle is detected using a vision system and comparing the currently acquired image of each nozzle with the image of an “ideal” nozzle. Likewise, contamination such as adhesive on the nozzle is detected before that contamination can affect placement accuracy. Because of the nozzle inspection during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: A pick and place head for a pick and place machine includes a stationary frame; a first circuit board mounted on the stationary frame, the first circuit board including a first plurality of electric circuits; a rotating frame rotatably mounted to the stationary frame; a plurality of spindle assemblies mounted one the rotating frame, each of the plurality of spindle assemblies including a set of electric contacts; a second circuit board mounted on the rotating frame, the second circuit board including a second plurality of electric circuits; a slip ring assembly mounted between the first circuit board and the second circuit board; the slip ring assembly including a first portion and a second portion; the first portion of the slip ring assembly being rotatable relative to the second portion of the slip ring assembly, and the slip ring assembly further including a set of electrical connectors that enable the first plurality of electric circuits to maintain electrical connection with the second plurality of elect

Abstract: A spindle assembly drive system that includes a rack unit, a drive gear, a motor, and a plurality of bearings, such that said rack unit laterally moves in a first axis with little or no movement in or rotation about any other axis.

Abstract: The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using an automated vision system. The image processing determines whether the component is placeable based upon a comparison of the component image to preprogrammed mechanical parameters for the component. A non-placeable component is rejected into a reject station, which is contiguous with the head. Because a component can be rejected during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: The present invention features a method whereby the vacuum nozzle of each extendable vacuum spindle in a multi-head component placement machine may be calibrated during component pick/place cycles. Calibration of each vacuum nozzle ensures accurate location of the vacuum nozzle over a component at a component pick station. This is particularly important with extremely small components where a slight misalignment of a vacuum nozzle with a component to be picked could result in a missed pick. Because of the vacuum nozzle inspection and calibration on the fly during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: A method for conveying printed circuit boards (PCBs) in a system that includes at least two assembly modules, where each assembly module has multiple conveyors for delivering the PCBs so that while processing some PCBs, other PCBs can bypass particular assembly modules.

Abstract: The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using an automated vision system. The image processing determines whether the component is placeable based upon a comparison of the component image to preprogrammed mechanical parameters for the component. A non- placeable component is rejected into a reject station, which is contiguous with the head. Because a component can be rejected during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: A component pick and place apparatus includes a housing including; a rotatable frame and a plurality of pick-up and place heads mounted on the frame. The pick-up and place heads are rotatable from a first position to at least a second position, and includes a spindle which is movable from a retracted position to an extended position. A first actuator moves the spindle at the first position from the retracted position to the extended position for picking up or placing the component; and a second actuator moves a spindle so that when a pick-up and place head is at the second position a spindle is moved from the retracted position to the extended position for ascertaining the position of the picked-up component. This apparatus eliminates positional errors of the pick-up and place head spindle as it moves from its retracted position to its extended position when the component is placed.

Abstract: A dispenser includes a viscous fluid feed cavity and dispense cavity with an intermediate passageway therebetween and a diaphragm mounted for reciprocatory movement so positioned that during the dispensing process, the movable diaphragm is moved between a first position wherein the passageway is opened, a second position to close the passageway, and a third position to affect viscous fluid dispensing through an outlet coupled to the dispensing cavity. A diaphragm position sensor is provided for determining the relative position of the movable portion of the diaphragm, the sensor being functionally coupled to the diaphragm actuator, such that the diaphragm actuator is controllable in accordance with the relative position of the diaphragm to insure accurate control of micro quantities of viscous fluid dispensed from the dispenser.

Abstract: An apparatus for the application of a conductive adhesive medium in a fluid state to a side of a printed circuit board bearing electronic components is disclosed. The apparatus generally comprises a hollow shaft standing in a supply tank for the adhesive medium in an obliquely rising conveyor belt for at least one circuit board at a time. The upper end of the hollow shaft has two overflow edges arranged perpendicularly to the direction of transport for the formation of a wave, through the crest of which the side of the card previously moistened with a flux, is passed.