Abstract: A sensing system comprises a photonics integrated circuit partially encapsulated by an encapsulation material and the photonics integrated circuit comprising a first integrated sensor accessible to a target analyte and being positioned in a part of the photonics integrated circuit not being encapsulated by an encapsulation material, and a second integrated sensor accessible to a reference substance and being positioned in a part of the photonics integrated circuit that is encapsulated by an encapsulation material. The sensing system is further adapted to, when in use, comprise the reference substance but less or no target analyte between the second integrated sensor and the encapsulation material as compared to the amount of target analyte being present at the first integrated sensor.

Abstract: An implantable optical sensor (1) comprising a substrate (2) and at least one optical microstructure (3) for evanescent field sensing integrated with the substrate (2), the at least one optical microstructure (3) being positioned to form an optical interaction area (4) on a part of a surface (5) of the substrate (2), the optical assembly (1) further comprising a thin protective layer (6) covering at least the optical interaction area (4), the thin protective layer (6) being in a predetermined material with corrosion-protection characteristics and having a predetermined thickness, so as not to affect the evanescent field sensing.

Abstract: An implantable optical sensor comprises a photonic integrated circuit comprising a substrate 2 and an optical microstructure 3 integrated with the substrate 2. The optical microstructure is positioned to form an exposed optical interaction area 4 on a part of a surface 5 of the substrate 2. A cover cap 6 is sealed onto a part of the substrate 2 adjacent to the optical interaction area 4 and by wafer-to-wafer bonding technology or another wafer-level hermetic packaging technique. At least one active component 8 is positioned in a sealed cavity 9 which is formed between the surface 5 and the cover cap 6. The substrate 2 comprises at least one optical feedthrough 10, which is an embedded waveguide extending from the sealed cavity 9 to the optical interaction area 4.

Abstract: A photonics integrated circuit includes a photonics platform having a waveguide layer having a waveguide and a wiring substrate with an active component positioned thereon and extending therefrom. The active component has a component top surface facing away from the wiring substrate and component side surfaces through which radiation can be coupled. The photonics platform comprises a recess wherein the active component can be positioned such that the component top surface of the active component is positioned on a surface of the recess. The photonics platform and the active component are being configured for allowing lateral optical coupling between the waveguide in the photonics platform and at least one of the component side surfaces of the active component.

Abstract: A battery housing for use in an active implantable medical device comprising a battery and a signal transferring element is described. The battery housing is adapted for holding the signal transferring element at a fixed position around the battery housing. A corresponding implantable device also is disclosed.

Abstract: An implantable optical sensor comprises a photonic integrated circuit comprising a substrate 2 and an optical microstructure 3 integrated with the substrate 2. The optical microstructure is positioned to form an exposed optical interaction area 4 on a part of a surface 5 of the substrate 2. A cover cap 6 is sealed onto a part of the substrate 2 adjacent to the optical interaction area 4 and by wafer-to-wafer bonding technology or another wafer-level hermetic packaging technique. At least one active component 8 is positioned in a sealed cavity 9 which is formed between the surface 5 and the cover cap 6. The substrate 2 comprises at least one optical feedthrough 10, which is an embedded waveguide extending from the sealed cavity 9 to the optical interaction area 4.

Abstract: The present invention relates to a personal health monitoring system comprising an implantable sensor and a monitoring device. The present invention further relates to a multiple user health monitoring system comprising a plurality of such personal health monitoring systems. The present invention further relates to a method of monitoring the biological parameters of at least one user.

Abstract: An implantable optical sensor (1) comprising a substrate (2) and at least one optical microstructure (3) for evanescent field sensing integrated with the substrate (2), the at least one optical microstructure (3) being positioned to form an optical interaction area (4) on a part of a surface (5) of the substrate (2), the optical assembly (1) further comprising a thin protective layer (6) covering at least the optical interaction area (4), the thin protective layer (6) being in a predetermined material with corrosion-protection characteristics and having a predetermined thickness, so as not to affect the evanescent field sensing.

Abstract: A sensing system comprises a photonics integrated circuit partially encapsulated by an encapsulation material and the photonics integrated circuit comprising a first integrated sensor accessible to a target analyte and being positioned in a part of the photonics integrated circuit not being encapsulated by an encapsulation material, and a second integrated sensor accessible to a reference substance and being positioned in a part of the photonics integrated circuit that is encapsulated by an encapsulation material. The sensing system is further adapted to, when in use, comprise the reference substance but less or no target analyte between the second integrated sensor and the encapsulation material as compared to the amount of target analyte being present at the first integrated sensor.

Abstract: A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).

Abstract: The present invention relates to an externally worn transducer module (1) for use with an implant (101), which module (1) comprises: —a transducer (5) for converting energy into electrical signals, —a wireless interface (19), configured to transfer data signals to and/or from the implant (101), and receive electrical power from the implant (101), —circuitry (8) operably connected to the transducer (5) and interface (19) configured to: —receive electrical power from the interface (19), —convert electrical signals generated by the transducer into data signals responsive to the electrical signals, and —provide data signals to the interface (19), and —housing (2) that forms a protective body of the module (1), which housing (1) is configured for external attachment to the body of the wearer. It particularly relates to a microphone module for use with a hearing aid implant. It also relates to a kit comprising the module and optionally comprising the implant, and tools for user insertion and maintenance.

Abstract: Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.

Abstract: A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

Abstract: A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.

Abstract: Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.

Abstract: A method of reflowing a polymer to form a spring or coil structure is described. A polymer is deposited over stress engineered thin film with an internal stress gradient. The polymer serves as a loading prevent release of the internal stress until a solvent vapor softens and reflows the polymer. As the polymer softens, the internal stress within the thin film is gradually released allowing controlled curling of the thin film out of a substrate plane. In one embodiment, the thin film forms the windings of a coil structure.

Abstract: An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.

Abstract: In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.

Abstract: A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.

Abstract: A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.