Patents by Inventor Koh Fuwa

Koh Fuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190290244
    Abstract: A ultrasound probe according to this invention is provided with: a first dry film resist having a plurality of first apertures formed in an array shape, and respectively supporting the piezoelectric elements in close contact with a rim part of each of the first apertures in a state of partly exposing the function elements; a second dry film resist laminated on the first dry film resist, and also having second apertures respectively enclosing each of the function elements, the second dry film resist being of a thickness equivalent to that of each of the function elements; and a third dry film resist laminated on the second dry film resist, and also having third apertures, and respectively sandwiching each of the piezoelectric elements with the first dry film resist in a state of partly exposing the piezoelectric elements in close contact with a rim part of each of the third apertures.
    Type: Application
    Filed: August 15, 2017
    Publication date: September 26, 2019
    Applicants: Ulvac, Inc., Tohoku University
    Inventors: Taichi SUZUKI, Koh FUWA, Ken MAEHIRA, Yasutomo OHASHI, Katsuhiro FUJITA, Yoichi HAGA, Tadao MATSUNAGA
  • Publication number: 20140158301
    Abstract: A vacuum processing device and a vacuum processing method that strongly chuck and hold an insulating substrate when plasma processing is performed are provided. The vacuum processing device includes a vacuum chamber that is grounded; a vacuum evacuation device connected to the vacuum chamber; a chuck device arranged inside the vacuum chamber; a chuck power supply for applying an output voltage to a single-pole type electrode provided in the chuck device; a plasma generation gas introduction device for introducing a plasma generation gas into the vacuum chamber; and a plasma generation portion which converts the plasma generation gas into plasma. An object to be processed is arranged on the chuck device; and the chuck power supply applies an output voltage to the single-pole type electrode while the plasma is being generated inside the vacuum chamber; and the object to be processed is processed by the plasma while the object to be processed is being chucked by the chuck device.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 12, 2014
    Applicant: ULVAC, Inc.
    Inventors: Ken MAEHIRA, Taichi SUZUKI, Eriko MASE, Koh FUWA
  • Publication number: 20110089141
    Abstract: A multi-stepped substrate having a plurality of steps is produced by forming, on the principal surface of a substrate, a plurality of masks which are put on top of each other, which differ from each other in the materials used for forming them and which are likewise different, from each other, in the means for peeling off the same; and that the substrate is subjected, in order, to dry-etching operations through the plurality of masks each having a desired shape such that the substrate has a plurality of steps each of which reflects the shape of each corresponding mask.
    Type: Application
    Filed: June 15, 2009
    Publication date: April 21, 2011
    Applicant: ULVAC,INC.
    Inventors: Ai Tanaka, Atsushi Kira, Koh Fuwa
  • Patent number: 7209339
    Abstract: An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, and an insulative support base plate fixing said dielectric layer. A distance between adjacent ones of the electrodes and the thickness of the dielectric layer are adjusted such that when a potential difference is established between the electrodes, a non-uniform electric field is formed in which the insulative substrate is partially polarized and attracted to the first surface by gradient force.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: April 24, 2007
    Assignees: Ulvac, Inc., Toto Ltd.
    Inventors: Tetsuo Kitabayashi, Hiroaki Hori, Takeshi Uchimura, Noriaki Tateno, Koh Fuwa, Ken Maehara
  • Publication number: 20040218340
    Abstract: An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, and an insulative support base plate fixing said dielectric layer. A distance between adjacent ones of the electrodes and the thickness of the dielectric layer are adjusted such that when a potential difference is established between the electrodes, a non-uniform electric field is formed in which the insulative substrate is partially polarized and attracted to the first surface by gradient force.
    Type: Application
    Filed: May 28, 2004
    Publication date: November 4, 2004
    Applicants: Toto, Ltd., Ulvac, Inc.
    Inventors: Tetsuo Kitabayashi, Hiroaki Hori, Takeshi Uchimura, Noriaki Tateno, Koh Fuwa, Ken Maehara
  • Patent number: 6781812
    Abstract: A chuck equipment which can hold insulating substrates is provided. First and second electrodes are provided to be exposed on the base the surface of which is insulated. The insulating substrate is placed in contact with or in close proximity to the surfaces of the first and second electrodes. Since an electric field having a high rate of spatial change is established between the first and second electrodes, the substrate is held against the surface of the chuck equipment by the gradient force. Since the magnitude of the gradient force depends on that of the rate of change of the electric field, a voltage may be applied between the first and second electrodes to establish an electric field of 1.0×106V/m or greater.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: August 24, 2004
    Assignee: Nihon Shinku Gijutsu Kabushiki Kaisha
    Inventors: Koh Fuwa, Ken Maehira
  • Patent number: 6768627
    Abstract: According to the present invention, there is provided an electrostatic chuck for electrostatically attracting an insulative substrate, an apparatus for heating/cooling an insulative substrate using the electrostatic chuck, and a method for controlling the temperature of an insulative substrate. The shape and the properties of the dielectric, and the shape of the electrodes, which form the electrostatic chuck, are disclosed. Also the apparatus for heating/cooling an insulative substrate comprising a plate, a gas supply conduit and a temperature controlling system, and the apparatus for processing an insulative substrate in which the apparatus for heating/cooling an insulative substrate is installed are disclosed.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: July 27, 2004
    Assignees: Toto Ltd., Ulvac, Inc.
    Inventors: Tetsuo Kitabayashi, Hiroaki Hori, Takeshi Uchimura, Noriaki Tateno, Koh Fuwa, Ken Maehira
  • Publication number: 20020135967
    Abstract: A chuck equipment which can hold insulating substrates is provided. First and second electrodes are provided to be exposed on the base the surface of which is insulated. The insulating substrate is placed in contact with or in close proximity to the surfaces of the first and second electrodes. Since an electric field having a high rate of spatial change is established between the first and second electrodes, the substrate is held against the surface of the chuck equipment by the gradient force. Since the magnitude of the gradient force depends on that of the rate of change of the electric field, a voltage may be applied between the first and second electrodes to establish an electric field of 1.0×106 V/m or greater.
    Type: Application
    Filed: January 24, 2001
    Publication date: September 26, 2002
    Applicant: NIHON SHINKU GIJUTSU KABUSHIKI KAISHA
    Inventors: Koh Fuwa, Ken Maehira