Abstract: A small-sized fuse is provided that has a large breaking capability and is easy to manufacture. When a fusible element 18 melts and turns into metal vapor, arc discharge occurs in a large space 40 across which the fusible element 18 extends, of an inner space 26, and a pressure in the large space 40 rises instantaneously to an extremely large degree. Due to this pressure rise, the breaking member 24 moves from a position shown in FIG. 5A to a position shown in FIG. 5B. With the movement of the breaking member 24, the breaking member 24 closes instantaneously link holes 36 and 38 in a main body, whereby a flow of electrons is interrupted and the arc discharge is extinguished instantaneously.

Abstract: A miniature fuse of surface mount type having a stable pre-arcing time-current characteristic and a strong time lag characteristic The fuse is easy to produce, and provides a constant pre-arcing time. The main body of the fuse is of rectangular ceramic construction of split type. A fusible member (60) wound around a ceramic rod (58) and is rested on a recessed portion (62) of the lower ceramic casing (54). The end portion (76) of the fusible member (60) is engaged with the side surface of the casing. The upper ceramic casing (52) is laid on the lower casing, so that the caps (56) are fit onto the opposite ends of the main body. The end portion (76) of the fusible member (60) and the cap (56) are connected by welding. At the time of welding, projections (74) to be fit in the recessed portions (72) provided at the main body, is formed at the cap (56), so that the cap (56) can be fixed to the main body.

Abstract: A miniature fuse of surface mount type having a stable pre-arcing time-current characteristic and a strong time lag characteristic, being easy to produce, and providing a constant pre-arcing time is provided. The main body is of rectangular ceramic construction of split type. A fusible member 60 (Ag:Cu:An=>50%:>20%>17%:>5% (weight ratio) wound around the ceramic rod 58 (A12O3:MgO:BeO=>96%:>3%:>3%:<1% (weight ratio) is rested on the recessed portion 62 of the lower ceramic casing 54. The end portion 76 of the fusible member 60 is engaged with the side surface of the casing. The upper ceramic casing 52 is laid on the lower casing, so that the cap 56 is fit onto the opposite ends of the main body. The end portion 76 of the fusible member 60 and the cap 56 are connected by welding. At the time of welding, projection 74 to be fit in the recessed portion 72 provided at the main body is formed at the cap 56, so that the cap 56 can be fixed to the main body.

Abstract: A microchip fuse is disclosed which includes a casing constructed from box-like upper and lower members. On the end surfaces of both members, electrode sections are provided which are formed by plating metal onto a sintered conductive paste on the end surfaces. Grooves are provided on the members and filled with insulating material. A fusible element extends through the insulating material and the inner surface as formed when the both members are jointed together. The end portions of the fusible element are soldered to the electrode sections. A hollow portion is provided in the casing adjacent to the inner space by way of a thin wall to dampen the pressure of a gas generated during the interruption process.

Abstract: A micro-chip fuse and a method of manufacturing the fuse is disclosed which includes a fusible element made of a metallic film that is formed by a depositioning process. Through-bores are provided through a first substrate and filled with a photosensitive resist to make smooth the surface of the first substrate. After curing the resist, metal is deposited on the surface of the first substrate to form a metallic film. A photosensitive resist is applied to the metallic film and a photomask is placed on the resist to effect an exposure and a development. The metallic film is etched and the resists are removed to form the fusible elements made of the metallic film extending over the through-bores. A second substrate is placed under the first substrate, and a third substrate including recesses for cover the through-bores is placed on the first substrate to laminate them. Electrodes are provided on the ends of the substrates. The laminated substrates are divided into individual micro-chip fuses.