Abstract: A self-ballasted electrodeless discharge lamp of the invention is provided with a discharge vessel filled with discharge gas, the discharge vessel having a cavity portion, a coil inserted into the cavity portion of the discharge vessel, a ballast circuit for supplying high frequency power to the coil, and a lamp base that is electrically connected to the ballast circuit, wherein the discharge vessel, the coil, the ballast circuit, and the lamp base are configured as a single unit, and a reflective tape for reflecting light that is radiated from the discharge gas and emitted from inside the discharge vessel to its cavity portion side is wound around the coil.

Abstract: A self-ballasted electrodeless discharge lamp of the invention is provided with a discharge vessel filled with discharge gas, the discharge vessel having a cavity portion, a coil inserted into the cavity portion of the discharge vessel, a ballast circuit for supplying high frequency power to the coil, and a lamp base that is electrically connected to the ballast circuit, wherein the discharge vessel, the coil, the ballast circuit, and the lamp base are configured as a single unit, and a reflective tape for reflecting light that is radiated from the discharge gas and emitted from inside the discharge vessel to its cavity portion side is wound around the coil.

Abstract: A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently.

Abstract: A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced.

Abstract: A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).

Abstract: An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.