Patents by Inventor Kohei HARATANI

Kohei HARATANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240055774
    Abstract: An antenna device includes: a main substrate provided with a ground electrode extending in a Y-axis direction; and a sub-substrate mounted on the main substrate. The sub-substrate includes: an upper surface on which a first antenna element and a second antenna element are arranged side by side in the Y-axis direction; and a lower surface on which a mounting terminal portion is disposed. A recessed portion recessed toward the upper surface is formed in a central region (a region between the first antenna element and the second antenna element of the lower surface of the sub-substrate.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Kohei HARATANI
  • Publication number: 20230207999
    Abstract: A multilayer substrate in which dielectric layers are laminated, the multilayer substrate including: a first electrode formed on the dielectric layers; and a first ground electrode disposed so as to be opposite to the first electrode in a multilayer direction. In the multilayer substrate, a plurality of dielectric layers include a first layer and a second layer that are disposed between a layer in which the first electrode is formed and a layer in which the first ground electrode is formed. In the first layer, a filler having permittivity lower than permittivity of a base material forming the dielectric layer is not disposed. In the second layer, the filler is disposed in at least a part of a region where the first electrode and the first ground electrode overlap each other in planar view of the multilayer substrate from the multilayer direction.
    Type: Application
    Filed: February 20, 2023
    Publication date: June 29, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kohei HARATANI, Kengo ONAKA, Hirotsugu MORI