Patents by Inventor Kohei Hayashi

Kohei Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879839
    Abstract: A substrate processing apparatus includes a supply channel through which a liquid to be supplied to a substrate flows; and a foreign substance detecting unit configured to detect a foreign substance in the liquid based on a signal obtained when light, which is near-infrared light, is radiated toward a flow path forming unit constituting a part of the supply channel by a light projector so that light is emitted from the flow path forming unit and a light receiver receives the light emitted from the flow path forming unit.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: January 23, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koudai Higashi, Masato Hayashi, Kohei Noguchi
  • Patent number: 11864314
    Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 2, 2024
    Assignees: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Kohei Hayashi, Soichi Obata, Yasuhiro Shirotani, Masashi Nitani, Mayumi Uno, Kazuki Maeda
  • Publication number: 20230410644
    Abstract: A traffic congestion determination device includes an acquisition unit configured to acquire a total number of automobiles for each mesh obtained by virtually dividing a determination target region of traffic congestion and for each unit time, and a determination unit configured to determine whether occurrence of traffic congestion is sudden for each of the meshes based on the acquired total number of automobiles for each of the meshes and unit time.
    Type: Application
    Filed: November 17, 2020
    Publication date: December 21, 2023
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Aki HAYASHI, Yuki YOKOHATA, Takahiro HATA, Kohei MORI, Kazuaki OBANA
  • Publication number: 20230411339
    Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 21, 2023
    Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
  • Publication number: 20230402421
    Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 14, 2023
    Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
  • Publication number: 20230395474
    Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
  • Publication number: 20230395475
    Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 7, 2023
    Inventors: Kohei TANIKAWA, Kenji HAYASHI, Ryosuke FUKUDA
  • Publication number: 20230395476
    Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 7, 2023
    Inventors: Kohei TANIKAWA, Kenji HAYASHI, Ryosuke FUKUDA
  • Publication number: 20230332921
    Abstract: An estimation method includes acquiring sensor information acquired by a sensor mounted on a first vehicle belonging to a vehicle line, acquiring position information on a location of the first vehicle, and estimating a cause of the vehicle line by using the sensor information and the position information. The estimating of the cause includes estimating the cause by using information on a facility or a feature present near the first vehicle, information indicating a state of the first vehicle, information on an object present ahead of the first vehicle included in the sensor information, or information on a road that affects traveling. The information on the facility or the feature is searched based on the position information, the information on the object is estimated based on the sensor information, and the information on the road is searched based on the position information.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 19, 2023
    Inventors: Kohei MORI, Kazuaki OBANA, Takahiro HATA, Yuki YOKOHATA, Aki HAYASHI
  • Publication number: 20230308035
    Abstract: (1) A motor control device of the present invention includes a magnetic-flux command value generator and a current-command value generator. The magnetic-flux command value generator is configured to generate a magnetic-flux command value based on a torque-command value. The current-command value generator is configured to generate a current-command value on the basis of the magnetic-flux command value. The magnetic-flux command value generator includes a magnetic-flux command calculator, a feedback-value calculator, a magnetic-flux compensation value calculator, a magnetic-flux command value calculator, and a control-gain changer.
    Type: Application
    Filed: March 28, 2023
    Publication date: September 28, 2023
    Inventors: Takami SUZUKI, Kohei ONISHI, Tomoyuki DANSAKO, Tomofumi HAYASHI, Satoshi FUJISHIRO, Yoshihiro ITO
  • Publication number: 20230307411
    Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.
    Type: Application
    Filed: September 27, 2021
    Publication date: September 28, 2023
    Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
  • Patent number: 11770044
    Abstract: A rotating electrical machine such that positional deviation caused by a part tolerance can be absorbed in an electrical connection between a power conversion device and a rotating electrical machine main body, and size can be reduced without a structure becoming complex, is obtained. The rotating electrical machine is characterized by including a power terminal unit of the rotating electrical machine main body housed in a housing, the power conversion device fixed to the housing, and a multilayer bus bar connected to the power terminal unit of the rotating electrical machine main body as a power terminal of the power conversion device, wherein the multilayer bus bar has flexibility, and is bent by being connected to the power terminal unit.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: September 26, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ryohei Hayashi, Kohei Seike, Mitsuo Sone
  • Publication number: 20230286162
    Abstract: A posture of a component is to be accurately determined. A posture determination method is to determine, based on an image acquired for a component having a plurality of surfaces, a posture of the component. This posture determination method includes recognizing an outer shape of the component from the image, detecting a feature amount of a surface shape in a determination area being a part of the component based on the outer shape of the component recognized in the recognizing, and determining. In the determining, the posture of the component is determined by comparing a first reference amount indicating a reference feature amount in the determination area of a first surface of the component and a second reference amount indicating a reference feature amount in the determination area of a second surface of the component with the feature amount detected in the detecting.
    Type: Application
    Filed: November 2, 2022
    Publication date: September 14, 2023
    Applicant: KONICA MINOLTA, INC.
    Inventors: Tomoyoshi YUKIMOTO, Yasuyuki KAMAI, Shigeki NOZAWA, Harumitsu FUJIMORI, Kohei HAYASHI
  • Patent number: 11741938
    Abstract: There is provided a mechanism that enables cooperation of a plurality of audio processing devices. An earphone device includes a sensor unit that detects an overlapping state of the earphone device and a headphone device and a wireless communication unit that wirelessly communicates with the headphone device which is worn to overlap an outer side of the earphone device worn by a user.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: August 29, 2023
    Assignee: SONY GROUP CORPORATION
    Inventors: Kohei Asada, Go Igarashi, Naoki Shinmen, Shigetoshi Hayashi
  • Publication number: 20230253297
    Abstract: A semiconductor module includes a supporting substrate, a conductive substrate supported by the supporting substrate, a conductive bonding member provided between the supporting substrate and the conductive substrate, and a semiconductor element electrically bonded to an obverse surface of the conductive substrate and having a switching function. The conductive bonding member includes a metal base layer, a first layer, and a second layer. The first layer is provided between the base layer and the conductive substrate, and is in direct contact with the conductive substrate. The second layer is provided between the base layer and the supporting substrate, and is in direct contact with the supporting substrate.
    Type: Application
    Filed: September 15, 2021
    Publication date: August 10, 2023
    Inventors: Kohei TANIKAWA, Kenji HAYASHI
  • Publication number: 20230245960
    Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.
    Type: Application
    Filed: September 13, 2021
    Publication date: August 3, 2023
    Inventors: Kenji HAYASHI, Kohei TANIKAWA, Ryosuke FUKUDA
  • Publication number: 20230245961
    Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
    Type: Application
    Filed: September 14, 2021
    Publication date: August 3, 2023
    Inventors: Kohei TANIKAWA, Kenji HAYASHI, Ryosuke FUKUDA
  • Publication number: 20230245956
    Abstract: A semiconductor module includes: a conductive substrate having an obverse surface and a reverse surface spaced apart in a thickness direction; a semiconductor element electrically bonded to the obverse surface and having a switching function; and a conducting member that forms a path of a main circuit current switched by the semiconductor element. The semiconductor element has a rectangular shape with four corners as viewed in the thickness direction. The conducting member includes a portion overlapping with the semiconductor element as viewed in the thickness direction. The conducting member do not overlap with at least three of the four corners of the semiconductor element.
    Type: Application
    Filed: September 24, 2021
    Publication date: August 3, 2023
    Inventors: Kohei TANIKAWA, Kenji HAYASHI
  • Patent number: D997850
    Type: Grant
    Filed: November 25, 2021
    Date of Patent: September 5, 2023
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Kohei Sahashi, Shintaro Hayashi
  • Patent number: D999747
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 26, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Kohei Tanikawa, Kenji Hayashi