Patents by Inventor Kohei Hayashi

Kohei Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146405
    Abstract: A control apparatus capable of exhibiting the diversity effect in a hybrid mobile communication system using a terrestrial communication apparatus and a non-terrestrial communication apparatus is provided.
    Type: Application
    Filed: October 13, 2023
    Publication date: May 2, 2024
    Applicant: NEC Corporation
    Inventors: Kenji WAKAFUJI, Junichi FUNADA, Kohei YOSHIDA, Masakazu ONO, Kazuyuki HAYASHI
  • Publication number: 20240146400
    Abstract: At least one processor included in a server carries out: an acquiring process of acquiring, from a communication terminal configured to communicate with low earth orbit satellite equipment, information which indicates a communication condition in the communication terminal regarding communication with the low earth orbit satellite equipment; and a controlling process of referring to a radio wave map of a region including a location of the communication terminal and the information, to control an air vehicle configured to measure an attenuation of a radio wave between the air vehicle and the communication terminal.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 2, 2024
    Applicant: NEC Corporation
    Inventors: Kazuyuki HAYASHI, Masakazu Ono, Junichi Funada, Kenji Wakafuji, Kohei Yoshida
  • Publication number: 20240125697
    Abstract: A substrate processing apparatus includes a supply channel through which a liquid to be supplied to a substrate flows; and a foreign substance detecting unit configured to detect a foreign substance in the liquid based on a signal obtained when light, which is near-infrared light, is radiated toward a flow path forming unit constituting a part of the supply channel by a light projector so that light is emitted from the flow path forming unit and a light receiver receives the light emitted from the flow path forming unit.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 18, 2024
    Inventors: Koudai Higashi, Masato Hayashi, Kohei Noguchi
  • Patent number: 11961790
    Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.
    Type: Grant
    Filed: August 21, 2023
    Date of Patent: April 16, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
  • Publication number: 20240117265
    Abstract: One aspect of the present invention relates to a naphthyl phenyl ether compound represented by formula (1): in the formula (1), R1 and R2 are the same or different and each represent a linear or branched hydrocarbon group having 6 to 28 carbon atoms; m and n are each a real number of 0 or more and satisfy 1.0?m+n?3.0.
    Type: Application
    Filed: February 9, 2022
    Publication date: April 11, 2024
    Applicant: MORESCO CORPORATION
    Inventors: Tatsuya MAEDA, Mayumi HAYASHI, Kohei YAMASHITA, Masayuki HATA
  • Publication number: 20240116841
    Abstract: One aspect of the present invention relates to a dinaphthyl ether compound represented by formula (1): in the formula (1), R1 and R2 are the same or different and each represent a linear or branched hydrocarbon group having 6 to 32 carbon atoms; m and n are each a real number of 0 or more and satisfy 1.0?m+n?3.0.
    Type: Application
    Filed: February 9, 2022
    Publication date: April 11, 2024
    Applicant: MORESCO CORPORATION
    Inventors: Tatsuya MAEDA, Mayumi HAYASHI, Kohei YAMASHITA, Masayuki HATA
  • Patent number: 11955451
    Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
  • Patent number: 11955452
    Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
  • Patent number: 11955413
    Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
    Type: Grant
    Filed: August 24, 2023
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
  • Patent number: 11955414
    Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
    Type: Grant
    Filed: August 24, 2023
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
  • Patent number: 11945415
    Abstract: A vehicle-mounted sensor cleaning device cleans a sensing surface of a vehicle-mounted sensor. The vehicle-mounted sensor cleaning device includes a gas nozzle spraying a gas toward the sensing surface, a gas supply device supplying the gas to the gas nozzle, and a control section controlling operation of the gas supply device. A predetermined value is set in the control section, for indicating an abnormal state of detection accuracy of the vehicle-mounted sensor based on detection accuracy information of an object which is obtained from the vehicle-mounted sensor. A gas supply threshold value is also set, for use in operating the gas supply device to direct a supply of the gas toward the sensing surface before the detection accuracy information becomes equal to or lower than the predetermined value. If the detection accuracy information has become lower than the gas supply threshold value, the control section operates the gas supply device.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 2, 2024
    Assignee: DENSO CORPORATION
    Inventors: Yuji Hayashi, Kohei Toyama
  • Patent number: 11864314
    Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 2, 2024
    Assignees: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Kohei Hayashi, Soichi Obata, Yasuhiro Shirotani, Masashi Nitani, Mayumi Uno, Kazuki Maeda
  • Publication number: 20230286162
    Abstract: A posture of a component is to be accurately determined. A posture determination method is to determine, based on an image acquired for a component having a plurality of surfaces, a posture of the component. This posture determination method includes recognizing an outer shape of the component from the image, detecting a feature amount of a surface shape in a determination area being a part of the component based on the outer shape of the component recognized in the recognizing, and determining. In the determining, the posture of the component is determined by comparing a first reference amount indicating a reference feature amount in the determination area of a first surface of the component and a second reference amount indicating a reference feature amount in the determination area of a second surface of the component with the feature amount detected in the detecting.
    Type: Application
    Filed: November 2, 2022
    Publication date: September 14, 2023
    Applicant: KONICA MINOLTA, INC.
    Inventors: Tomoyoshi YUKIMOTO, Yasuyuki KAMAI, Shigeki NOZAWA, Harumitsu FUJIMORI, Kohei HAYASHI
  • Publication number: 20230101156
    Abstract: A treatment liquid is a treatment liquid including water; a cationic compound; an anionic compound selected from the group consisting of a resin having a carboxy group or a salt thereof, a resin having a sulfo group or a salt thereof, a resin having a phosphorous acid group or a salt thereof, and a resin having a phosphoric acid group or a salt thereof; and an oxidizing agent, in which the treatment liquid has a pH of 7.0 or less, and the treatment liquid is substantially free of abrasive grains.
    Type: Application
    Filed: August 23, 2022
    Publication date: March 30, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HAYASHI, Tomonori TAKAHASHI
  • Publication number: 20220275519
    Abstract: An object of the invention is to provide a cleaning liquid for semiconductor substrates having undergone a chemical mechanical polishing process, the cleaning liquid being excellent in corrosion prevention properties and defect suppression performance with respect to a metal film. Another object of the invention is to provide a method of cleaning semiconductor substrates having undergone a chemical mechanical polishing process. A cleaning liquid of the invention is used for semiconductor substrates having undergone a chemical mechanical polishing process and includes: an amine oxide compound that is a compound having an amine oxide group, or its salt; and at least one hydroxylamine compound selected from the group consisting of a hydroxylamine, a hydroxylamine derivative, and their salts, and the amine oxide compound content is 0.00001 to 0.15 mass % based on the total mass of the cleaning liquid.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 1, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HAYASHI, Tetsuya KAMIMURA
  • Publication number: 20220256695
    Abstract: A circuit board being able to easily ensure flatness of solder placed on a substrate for bonding an electronic component and improve bonding reliability of the electronic component by the solder, includes: a substrate having a plurality of layers made of a conductive material; a land provided on a first layer arranged on one side of the substrate, to which the electronic component is soldered; a heat sink provided on a different layer arranged on the substrate; a via hole provided on the substrate from a part of the land over to a part of the heat sink and electrically connected to the land and the heat sink; and an insulating resist disposed on the land and surrounding the entire circumference of the via hole.
    Type: Application
    Filed: February 7, 2022
    Publication date: August 11, 2022
    Applicant: AISIN CORPORATION
    Inventors: Kohei HAYASHI, Shuichi TAKEMOTO, Yuji KONDO, Takaya SUZUKI
  • Publication number: 20220225495
    Abstract: There is provided a control circuit board including a board, an integrated circuit, and a pad group. The board includes a first surface and a second surface, where the first surface and the second surface are on opposite sides of the board. The integrated circuit is disposed on the first surface of the board. The pad group is disposed on the second surface of the board and is electrically connected to the integrated circuit through a through-hole formed in the board.
    Type: Application
    Filed: December 9, 2021
    Publication date: July 14, 2022
    Inventor: Kohei HAYASHI
  • Publication number: 20220117083
    Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 14, 2022
    Applicants: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Kohei HAYASHI, Soichi OBATA, Yasuhiro SHIROTANI, Masashi NITANI, Mayumi UNO, Kazuki MAEDA
  • Publication number: 20210317391
    Abstract: The present invention addresses the problem of providing a kit for a cleaning agent, which is used for the purpose of preparing a cleaning agent that maintains, even after long-term storage, adequate impurity removal performance from the surface of a semiconductor substrate that has been subjected to a CMP process. The present invention also addresses the problem of providing a method for preparing the above-described cleaning agent. A kit for a cleaning agent according to the present invention is a kit for preparing a cleaning agent which is used for cleaning of a semiconductor substrate that has been subjected to a CMP process, and which has a pH of from 7.5 to 13.0. This kit for a cleaning agent comprises a first liquid that is acidic and contains a compound represented by formula (1) and a second liquid that is alkaline and contains a basic compound; and an acidic compound is contained in at least one of the first liquid and the second liquid.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicant: FUJIFILM Electronic Materials Co., Ltd.
    Inventors: Satoshi SHIRAHATA, Takahiro YOKOMIZO, Yoshihisa TSURUMI, Tsutomu WATAHIKI, Takayuki KAJIKAWA, Kohei HAYASHI, Hironori MIZUTA
  • Patent number: 10803845
    Abstract: The automatic performance device includes a storage part for storing a plurality of performance patterns, a performance part for playing a performance on the basis of a performance pattern stored in the storage part, an input part for inputting performance information through an input device that receives a performance operation of a user, and a selection part for selecting a performance pattern being a maximum likelihood estimation from the plurality of performance patterns stored in the storage part on the basis of the performance information input to the input part.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: October 13, 2020
    Assignees: Roland Corporation, Meiji University
    Inventors: Akihiro Nagata, Tokio Takahashi, Shigeki Sagayama, Kohei Hayashi