Patents by Inventor Kohei Hayashi
Kohei Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240146405Abstract: A control apparatus capable of exhibiting the diversity effect in a hybrid mobile communication system using a terrestrial communication apparatus and a non-terrestrial communication apparatus is provided.Type: ApplicationFiled: October 13, 2023Publication date: May 2, 2024Applicant: NEC CorporationInventors: Kenji WAKAFUJI, Junichi FUNADA, Kohei YOSHIDA, Masakazu ONO, Kazuyuki HAYASHI
-
Publication number: 20240146400Abstract: At least one processor included in a server carries out: an acquiring process of acquiring, from a communication terminal configured to communicate with low earth orbit satellite equipment, information which indicates a communication condition in the communication terminal regarding communication with the low earth orbit satellite equipment; and a controlling process of referring to a radio wave map of a region including a location of the communication terminal and the information, to control an air vehicle configured to measure an attenuation of a radio wave between the air vehicle and the communication terminal.Type: ApplicationFiled: October 19, 2023Publication date: May 2, 2024Applicant: NEC CorporationInventors: Kazuyuki HAYASHI, Masakazu Ono, Junichi Funada, Kenji Wakafuji, Kohei Yoshida
-
Publication number: 20240125697Abstract: A substrate processing apparatus includes a supply channel through which a liquid to be supplied to a substrate flows; and a foreign substance detecting unit configured to detect a foreign substance in the liquid based on a signal obtained when light, which is near-infrared light, is radiated toward a flow path forming unit constituting a part of the supply channel by a light projector so that light is emitted from the flow path forming unit and a light receiver receives the light emitted from the flow path forming unit.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Koudai Higashi, Masato Hayashi, Kohei Noguchi
-
Patent number: 11961790Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.Type: GrantFiled: August 21, 2023Date of Patent: April 16, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
-
Publication number: 20240117265Abstract: One aspect of the present invention relates to a naphthyl phenyl ether compound represented by formula (1): in the formula (1), R1 and R2 are the same or different and each represent a linear or branched hydrocarbon group having 6 to 28 carbon atoms; m and n are each a real number of 0 or more and satisfy 1.0?m+n?3.0.Type: ApplicationFiled: February 9, 2022Publication date: April 11, 2024Applicant: MORESCO CORPORATIONInventors: Tatsuya MAEDA, Mayumi HAYASHI, Kohei YAMASHITA, Masayuki HATA
-
Publication number: 20240116841Abstract: One aspect of the present invention relates to a dinaphthyl ether compound represented by formula (1): in the formula (1), R1 and R2 are the same or different and each represent a linear or branched hydrocarbon group having 6 to 32 carbon atoms; m and n are each a real number of 0 or more and satisfy 1.0?m+n?3.0.Type: ApplicationFiled: February 9, 2022Publication date: April 11, 2024Applicant: MORESCO CORPORATIONInventors: Tatsuya MAEDA, Mayumi HAYASHI, Kohei YAMASHITA, Masayuki HATA
-
Patent number: 11955451Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: GrantFiled: August 29, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
-
Patent number: 11955452Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion.Type: GrantFiled: August 29, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Kohei Tanikawa, Ryosuke Fukuda
-
Patent number: 11955413Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: GrantFiled: August 24, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
-
Patent number: 11955414Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.Type: GrantFiled: August 24, 2023Date of Patent: April 9, 2024Assignee: ROHM CO., LTD.Inventors: Kohei Tanikawa, Kenji Hayashi, Ryosuke Fukuda
-
Patent number: 11945415Abstract: A vehicle-mounted sensor cleaning device cleans a sensing surface of a vehicle-mounted sensor. The vehicle-mounted sensor cleaning device includes a gas nozzle spraying a gas toward the sensing surface, a gas supply device supplying the gas to the gas nozzle, and a control section controlling operation of the gas supply device. A predetermined value is set in the control section, for indicating an abnormal state of detection accuracy of the vehicle-mounted sensor based on detection accuracy information of an object which is obtained from the vehicle-mounted sensor. A gas supply threshold value is also set, for use in operating the gas supply device to direct a supply of the gas toward the sensing surface before the detection accuracy information becomes equal to or lower than the predetermined value. If the detection accuracy information has become lower than the gas supply threshold value, the control section operates the gas supply device.Type: GrantFiled: September 24, 2020Date of Patent: April 2, 2024Assignee: DENSO CORPORATIONInventors: Yuji Hayashi, Kohei Toyama
-
Patent number: 11864314Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.Type: GrantFiled: December 18, 2019Date of Patent: January 2, 2024Assignees: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kohei Hayashi, Soichi Obata, Yasuhiro Shirotani, Masashi Nitani, Mayumi Uno, Kazuki Maeda
-
Publication number: 20230286162Abstract: A posture of a component is to be accurately determined. A posture determination method is to determine, based on an image acquired for a component having a plurality of surfaces, a posture of the component. This posture determination method includes recognizing an outer shape of the component from the image, detecting a feature amount of a surface shape in a determination area being a part of the component based on the outer shape of the component recognized in the recognizing, and determining. In the determining, the posture of the component is determined by comparing a first reference amount indicating a reference feature amount in the determination area of a first surface of the component and a second reference amount indicating a reference feature amount in the determination area of a second surface of the component with the feature amount detected in the detecting.Type: ApplicationFiled: November 2, 2022Publication date: September 14, 2023Applicant: KONICA MINOLTA, INC.Inventors: Tomoyoshi YUKIMOTO, Yasuyuki KAMAI, Shigeki NOZAWA, Harumitsu FUJIMORI, Kohei HAYASHI
-
Publication number: 20230101156Abstract: A treatment liquid is a treatment liquid including water; a cationic compound; an anionic compound selected from the group consisting of a resin having a carboxy group or a salt thereof, a resin having a sulfo group or a salt thereof, a resin having a phosphorous acid group or a salt thereof, and a resin having a phosphoric acid group or a salt thereof; and an oxidizing agent, in which the treatment liquid has a pH of 7.0 or less, and the treatment liquid is substantially free of abrasive grains.Type: ApplicationFiled: August 23, 2022Publication date: March 30, 2023Applicant: FUJIFILM CorporationInventors: Kohei HAYASHI, Tomonori TAKAHASHI
-
Publication number: 20220275519Abstract: An object of the invention is to provide a cleaning liquid for semiconductor substrates having undergone a chemical mechanical polishing process, the cleaning liquid being excellent in corrosion prevention properties and defect suppression performance with respect to a metal film. Another object of the invention is to provide a method of cleaning semiconductor substrates having undergone a chemical mechanical polishing process. A cleaning liquid of the invention is used for semiconductor substrates having undergone a chemical mechanical polishing process and includes: an amine oxide compound that is a compound having an amine oxide group, or its salt; and at least one hydroxylamine compound selected from the group consisting of a hydroxylamine, a hydroxylamine derivative, and their salts, and the amine oxide compound content is 0.00001 to 0.15 mass % based on the total mass of the cleaning liquid.Type: ApplicationFiled: May 19, 2022Publication date: September 1, 2022Applicant: FUJIFILM CorporationInventors: Kohei HAYASHI, Tetsuya KAMIMURA
-
Publication number: 20220256695Abstract: A circuit board being able to easily ensure flatness of solder placed on a substrate for bonding an electronic component and improve bonding reliability of the electronic component by the solder, includes: a substrate having a plurality of layers made of a conductive material; a land provided on a first layer arranged on one side of the substrate, to which the electronic component is soldered; a heat sink provided on a different layer arranged on the substrate; a via hole provided on the substrate from a part of the land over to a part of the heat sink and electrically connected to the land and the heat sink; and an insulating resist disposed on the land and surrounding the entire circumference of the via hole.Type: ApplicationFiled: February 7, 2022Publication date: August 11, 2022Applicant: AISIN CORPORATIONInventors: Kohei HAYASHI, Shuichi TAKEMOTO, Yuji KONDO, Takaya SUZUKI
-
Publication number: 20220225495Abstract: There is provided a control circuit board including a board, an integrated circuit, and a pad group. The board includes a first surface and a second surface, where the first surface and the second surface are on opposite sides of the board. The integrated circuit is disposed on the first surface of the board. The pad group is disposed on the second surface of the board and is electrically connected to the integrated circuit through a through-hole formed in the board.Type: ApplicationFiled: December 9, 2021Publication date: July 14, 2022Inventor: Kohei HAYASHI
-
Publication number: 20220117083Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.Type: ApplicationFiled: December 18, 2019Publication date: April 14, 2022Applicants: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kohei HAYASHI, Soichi OBATA, Yasuhiro SHIROTANI, Masashi NITANI, Mayumi UNO, Kazuki MAEDA
-
Publication number: 20210317391Abstract: The present invention addresses the problem of providing a kit for a cleaning agent, which is used for the purpose of preparing a cleaning agent that maintains, even after long-term storage, adequate impurity removal performance from the surface of a semiconductor substrate that has been subjected to a CMP process. The present invention also addresses the problem of providing a method for preparing the above-described cleaning agent. A kit for a cleaning agent according to the present invention is a kit for preparing a cleaning agent which is used for cleaning of a semiconductor substrate that has been subjected to a CMP process, and which has a pH of from 7.5 to 13.0. This kit for a cleaning agent comprises a first liquid that is acidic and contains a compound represented by formula (1) and a second liquid that is alkaline and contains a basic compound; and an acidic compound is contained in at least one of the first liquid and the second liquid.Type: ApplicationFiled: June 25, 2021Publication date: October 14, 2021Applicant: FUJIFILM Electronic Materials Co., Ltd.Inventors: Satoshi SHIRAHATA, Takahiro YOKOMIZO, Yoshihisa TSURUMI, Tsutomu WATAHIKI, Takayuki KAJIKAWA, Kohei HAYASHI, Hironori MIZUTA
-
Patent number: 10803845Abstract: The automatic performance device includes a storage part for storing a plurality of performance patterns, a performance part for playing a performance on the basis of a performance pattern stored in the storage part, an input part for inputting performance information through an input device that receives a performance operation of a user, and a selection part for selecting a performance pattern being a maximum likelihood estimation from the plurality of performance patterns stored in the storage part on the basis of the performance information input to the input part.Type: GrantFiled: May 15, 2019Date of Patent: October 13, 2020Assignees: Roland Corporation, Meiji UniversityInventors: Akihiro Nagata, Tokio Takahashi, Shigeki Sagayama, Kohei Hayashi