Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.

Abstract: An image acquisition unit 20 acquires a group of time-series images captured by a camera mounted at the observation vehicle. A speed difference estimation unit 24 estimates a speed difference between the target object and the observation vehicle by using a time-series change in a region representing the target object captured in the group of time-series images. The determination unit 28 determines whether the target object or the observation vehicle is in a dangerous state based on the speed difference.

Abstract: Based on a three-dimensional model of a dynamic object having a position which changes, point group information which represents, with a group of points, a three-dimensional shape of the dynamic object is generated. Based on a three-dimensional model of a static object having a position which does not change, point group information representing, with a group of points, a three-dimensional shape of the static object is generated. Based on the point group information of the static object, voxel group information which represents, with a group of voxels, the three-dimensional shape of the static object, and which is formed into a database is generated. Presence or absence of overlap between the dynamic object and the static object is judged by collating voxel group information representing the static object which is present on a movement path of the dynamic object, and point group information representing the dynamic object.

Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.

Abstract: A posture of a component is to be accurately determined. A posture determination method is to determine, based on an image acquired for a component having a plurality of surfaces, a posture of the component. This posture determination method includes recognizing an outer shape of the component from the image, detecting a feature amount of a surface shape in a determination area being a part of the component based on the outer shape of the component recognized in the recognizing, and determining. In the determining, the posture of the component is determined by comparing a first reference amount indicating a reference feature amount in the determination area of a first surface of the component and a second reference amount indicating a reference feature amount in the determination area of a second surface of the component with the feature amount detected in the detecting.

Abstract: A treatment liquid is a treatment liquid including water; a cationic compound; an anionic compound selected from the group consisting of a resin having a carboxy group or a salt thereof, a resin having a sulfo group or a salt thereof, a resin having a phosphorous acid group or a salt thereof, and a resin having a phosphoric acid group or a salt thereof; and an oxidizing agent, in which the treatment liquid has a pH of 7.0 or less, and the treatment liquid is substantially free of abrasive grains.

Abstract: An object of the invention is to provide a cleaning liquid for semiconductor substrates having undergone a chemical mechanical polishing process, the cleaning liquid being excellent in corrosion prevention properties and defect suppression performance with respect to a metal film. Another object of the invention is to provide a method of cleaning semiconductor substrates having undergone a chemical mechanical polishing process. A cleaning liquid of the invention is used for semiconductor substrates having undergone a chemical mechanical polishing process and includes: an amine oxide compound that is a compound having an amine oxide group, or its salt; and at least one hydroxylamine compound selected from the group consisting of a hydroxylamine, a hydroxylamine derivative, and their salts, and the amine oxide compound content is 0.00001 to 0.15 mass % based on the total mass of the cleaning liquid.

Abstract: A circuit board being able to easily ensure flatness of solder placed on a substrate for bonding an electronic component and improve bonding reliability of the electronic component by the solder, includes: a substrate having a plurality of layers made of a conductive material; a land provided on a first layer arranged on one side of the substrate, to which the electronic component is soldered; a heat sink provided on a different layer arranged on the substrate; a via hole provided on the substrate from a part of the land over to a part of the heat sink and electrically connected to the land and the heat sink; and an insulating resist disposed on the land and surrounding the entire circumference of the via hole.

Abstract: There is provided a control circuit board including a board, an integrated circuit, and a pad group. The board includes a first surface and a second surface, where the first surface and the second surface are on opposite sides of the board. The integrated circuit is disposed on the first surface of the board. The pad group is disposed on the second surface of the board and is electrically connected to the integrated circuit through a through-hole formed in the board.

Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.

Abstract: The present invention addresses the problem of providing a kit for a cleaning agent, which is used for the purpose of preparing a cleaning agent that maintains, even after long-term storage, adequate impurity removal performance from the surface of a semiconductor substrate that has been subjected to a CMP process. The present invention also addresses the problem of providing a method for preparing the above-described cleaning agent. A kit for a cleaning agent according to the present invention is a kit for preparing a cleaning agent which is used for cleaning of a semiconductor substrate that has been subjected to a CMP process, and which has a pH of from 7.5 to 13.0. This kit for a cleaning agent comprises a first liquid that is acidic and contains a compound represented by formula (1) and a second liquid that is alkaline and contains a basic compound; and an acidic compound is contained in at least one of the first liquid and the second liquid.

Abstract: The automatic performance device includes a storage part for storing a plurality of performance patterns, a performance part for playing a performance on the basis of a performance pattern stored in the storage part, an input part for inputting performance information through an input device that receives a performance operation of a user, and a selection part for selecting a performance pattern being a maximum likelihood estimation from the plurality of performance patterns stored in the storage part on the basis of the performance information input to the input part.

Abstract: Provided are a novel polypeptide wherein a portion of DCTN1 protein is fused to a portion of RET protein; a polynucleotide encoding the polypeptide; a method for detecting the polynucleotide or the polypeptide; a method of screening for a compound that inhibits expression of the polynucleotide or expression and/or activity of the polypeptide; and a pharmaceutical composition containing a compound that inhibits RET as an active ingredient.

Abstract: The automatic performance device includes a storage part for storing a plurality of performance patterns, a performance part for playing a performance on the basis of a performance pattern stored in the storage part, an input part for inputting performance information through an input device that receives a performance operation of a user, and a selection part for selecting a performance pattern being a maximum likelihood estimation from the plurality of performance patterns stored in the storage part on the basis of the performance information input to the input part.

Abstract: The present invention relates to a cleaning agent for a semiconductor substrate having a copper wiring film or a copper alloy wiring film, and a cobalt-containing film to be used in a post-process of a chemical mechanical polishing process, comprising (A) an organic acid represented by general formula described in the present specification, (B) amines selected from the group consisting of (B-1) diamines, (B-2) amidines, (B-3) azoles, and (B-4) pyrazines or pyrimidines, represented by general formulae described in the present specification, (C) a hydroxylamine derivative, and (D) an oxygen scavenger represented by general formula described in the present specification, and being an aqueous solution having a pH of 10 or higher; and a processing method for the surface of a semiconductor substrate, having a copper wiring film or a copper alloy wiring film, and a cobalt-containing film, which comprises using the cleaning agent.

Abstract: An image forming apparatus includes: an image carrier configured to carry a toner image; a transfer member configured to transfer the toner image onto a transfer target member by applying a transfer voltage of the opposite polarity of the polarity of the toner image to the transfer target member, the transfer member being in contact with the image carrier; an accepting unit configured to accept a setting for changing a preset current range to a new current range, the preset current range being defined by one of a lower limit of a current flowing in the transfer target member and an upper limit of the current; a sensing unit configured to sense a magnitude of the current flowing in the transfer target member; and a control device configured to control the transfer voltage so that the magnitude of the sensed current falls within the new current range.

Abstract: An image formation apparatus includes: a fixer that fixes a toner image onto a sheet by heat and pressure, and includes: a heat source; a first rotary member that is heated by the heat source; a temperature sensing unit that senses a temperature of the first rotary member; and a second rotary member that forms a nip with the first rotary member for applying heat and pressure to the sheet; and a controller that calculates a nip width of the nip in a passing direction of the sheet with use of a rotation period and a rest period of the first rotary member during which the heat source operates, and changes a target temperature of the first rotary member in accordance with the calculated nip width.

Abstract: An image forming apparatus includes: an image carrier configured to carry a toner image; a transfer member configured to transfer the toner image onto a transfer target member by applying a transfer voltage of the opposite polarity of the polarity of the toner image to the transfer target member, the transfer member being in contact with the image carrier; an accepting unit configured to accept a setting for changing a preset current range to a new current range, the preset current range being defined by one of a lower limit of a current flowing in the transfer target member and an upper limit of the current; a sensing unit configured to sense a magnitude of the current flowing in the transfer target member; and a control device configured to control the transfer voltage so that the magnitude of the sensed current falls within the new current range.