Abstract: According to one embodiment, a pickup apparatus picks up one of a plurality of semiconductor chips from a sheet. The plurality of semiconductor chips is adhered to an upper surface of the sheet. The pickup apparatus includes a supporter, a presser, a suction-holder, and a lifter. The supporter is configured to support another of the semiconductor chips from below. The other semiconductor chip is positioned adjacent to the one semiconductor chip. The presser is configured to press the other semiconductor chip from above. The other semiconductor chip is clamped between the presser and the supporter. The suction-holder is configured to be movable upward with respect to the presser. The suction-holder holds the one semiconductor chip from above. The lifter is configured to lift the one semiconductor chip from below. The lifter urges the one semiconductor chip to peel from the sheet.

Abstract: According to one embodiment, a flexible wiring module includes a flexible wiring board which comprises electric wiring lines and an insulating layer that covers the surfaces of the electric wiring lines and which has a pair of end areas separate from each other in a wiring length direction and a wiring area sandwiched between the end areas. At least one through slit is made in the wiring area so as to connect the end areas, thereby dividing the wiring area into wiring fins. A stacked part where at least a part of the wiring fins are stacked in a thickness direction of the wiring fins is bundled together with a conductive band to form a wire-bundle area. In the wire-bundle area, the electric wiring line of at least one of the wiring fins is exposed and direct contact with the band.