Patents by Inventor Kohei HORIUCHI

Kohei HORIUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210197320
    Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.
    Type: Application
    Filed: December 14, 2020
    Publication date: July 1, 2021
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Kohei HORIUCHI
  • Publication number: 20200130105
    Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 30, 2020
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Shigetoshi MORI, Kohei HORIUCHI
  • Patent number: 10531566
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 7, 2020
    Assignee: AGC Inc.
    Inventors: Mamoru Isobe, Motoshi Ono, Shigetoshi Mori, Kohei Horiuchi
  • Publication number: 20190359515
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicant: AGC Inc.
    Inventors: Kohei HORIUCHI, Motoshi ONO
  • Patent number: 10442720
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 15, 2019
    Assignee: AGC Inc.
    Inventors: Kohei Horiuchi, Motoshi Ono
  • Publication number: 20190267317
    Abstract: A substrate has a non-through hole. The non-through hole has an opening with a diameter ?1 falling within a range of 5 to 200 ?m, and a depth d of 30 ?m or more. The non-through hole has a rounded end portion, and in a cross section of the non-through hole including a stretching axis of the non-through hole, a shape of the end portion is approximated by a circular arc with a diameter ?2, and a ratio of the diameters ?2/?1 falls within a range of 0.03 to 0.9. The cross section includes first and second wall lines defining side walls. A tapered angle fouled by a line L and the stretching axis falls within a range of 2° to 80°, the line L passing through a point on the first wall line separated from the opening by a distance 0.1×d and a point by a distance 0.5×d.
    Type: Application
    Filed: May 10, 2019
    Publication date: August 29, 2019
    Applicant: AGC inc.
    Inventors: Kohei HORIUCHI, Yoichiro SATO
  • Patent number: 10264672
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 16, 2019
    Assignee: AGC Inc.
    Inventors: Shigetoshi Mori, Motoshi Ono, Mamoru Isobe, Kohei Horiuchi
  • Publication number: 20190021170
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 17, 2019
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Motoshi ONO, Shigetoshi MORI, Kohei HORIUCHI
  • Publication number: 20180339936
    Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mamoru Isobe, Shigetoshi Mori, Kohei Horiuchi
  • Publication number: 20180317319
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 1, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Shigetoshi MORI, Motoshi ONO, Mamoru ISOBE, Kohei HORIUCHI
  • Publication number: 20180312432
    Abstract: A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 ?m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO, Mamoru ISOBE, Shigetoshi MORI
  • Patent number: 9857553
    Abstract: A lens unit may include a plurality of lenses; and a lens barrel made of resin and comprising a tube part. A first press-fitted lens of the plurality of lenses may include a first press-fitted portion that is press-fitted to the tube part. An outer peripheral face of the tube part may include a thread groove. The tube part may include a circular groove which is recessed from an image side end face of the tube toward an object side, the circular groove being formed between an inner peripheral face and the outer peripheral face of the tube part. The first press-fitted portion may be provided on an image side end of the first press-fitted lens. An object side end of the circular groove may be disposed on an object side of the first press-fitted portion.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: January 2, 2018
    Assignee: NIDEC SANKYO CORPORATION
    Inventors: Kohei Horiuchi, Tomoaki Nakajima
  • Publication number: 20170096361
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Application
    Filed: September 27, 2016
    Publication date: April 6, 2017
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO
  • Publication number: 20160349475
    Abstract: A lens unit may include a plurality of lenses; and a lens barrel made of resin and comprising a tube part. A first press-fitted lens of the plurality of lenses may include a first press-fitted portion that is press-fitted to the tube part. An outer peripheral face of the tube part may include a thread groove. The tube part may include a circular groove which is recessed from an image side end face of the tube toward an object side, the circular groove being formed between an inner peripheral face and the outer peripheral face of the tube part. The first press-fitted portion may be provided on an image side end of the first press-fitted lens. An object side end of the circular groove may be disposed on an object side of the first press-fitted portion.
    Type: Application
    Filed: February 10, 2015
    Publication date: December 1, 2016
    Applicant: Nidec Sankyo Corporation
    Inventors: Kohei HORIUCHI, Tomoaki NAKAJIMA
  • Patent number: 9205698
    Abstract: A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle ? (?90°<?<+90°) of the through-hole relative to a line perpendicular to the surface of the dummy substrate, and c) forming a through-hole in the insulating substrate with the same conditions as step a) except for radiating a laser at an angle ? relative to a line perpendicular to a surface of the insulating substrate. The angle ? is set to be line symmetric with the angle ? relative to the line perpendicular to the surface of the insulating substrate and satisfy a relationship of ?=??.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: December 8, 2015
    Assignee: ASAHI GLASS COMPANY, LIMITED
    Inventor: Kohei Horiuchi
  • Publication number: 20150329420
    Abstract: A method for forming a through-hole in a glass substrate includes the steps of (a) radiating a laser beam to a glass substrate, so that a through-hole penetrating the glass substrate from a first surface to a second surface is formed in a radiation area of the glass substrate, and a constricted part is formed in the through-hole, and (b) causing a discharge via the through-hole by applying a direct-current voltage between the first and second surfaces of the glass substrate, so that a diameter of a cross section of the constricted part that is substantially orthogonal to a longitudinal axis of the through-hole is increased.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 19, 2015
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kentaro TATSUKOSHI, Yuji Notsu, Kohei Horiuchi
  • Publication number: 20150323708
    Abstract: A cemented lens may include a first lens with a concave surface and a second lens with a convex surface. The concave surface of the first lens may be cemented to the convex surface of the second lens using an adhesive. The first lens may include an outer peripheral region. The second lens may include an outer peripheral region. An outer peripheral region on one side of the first lens side outer peripheral region and the second lens side outer peripheral region may include a protruded part. The first lens side outer peripheral region may include a recessed part which is extended in a circumferential direction so as to surround the lens face of the first lens.
    Type: Application
    Filed: December 13, 2013
    Publication date: November 12, 2015
    Inventors: Yoshiyuki HASHIMOTO, Kohei HORIUCHI
  • Publication number: 20150076113
    Abstract: A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle ? (?90°<?<+90°) of the through-hole relative to a line perpendicular to the surface of the dummy substrate, and c) forming a through-hole in the insulating substrate with the same conditions as step a) except for radiating a laser at an angle ? relative to a line perpendicular to a surface of the insulating substrate. The angle ? is set to be line symmetric with the angle ? relative to the line perpendicular to the surface of the insulating substrate and satisfy a relationship of ?=??.
    Type: Application
    Filed: September 9, 2014
    Publication date: March 19, 2015
    Inventor: Kohei HORIUCHI
  • Publication number: 20140202212
    Abstract: A press forming apparatus includes a mounting plate, a heating mechanism, and a die. The mounting plate supports a glass material on an upper surface of the mounting plate. The heating mechanism heats the glass material on the mounting plate to a temperature which allows press formation of the glass material. The die is provided to face the upper surface of the mounting plate and press forms the glass material heated by the heating mechanism between the die and the mounting plate.
    Type: Application
    Filed: March 24, 2014
    Publication date: July 24, 2014
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Koki MORIYA, Tomoharu HAYASHI, Kohei HORIUCHI, Keisuke YOSHIKUNI