Patents by Inventor Kohei Isayama

Kohei Isayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4104223
    Abstract: An aqueous epoxy resin paint composition comprising an epoxy resin emulsion formed by emulsifying a bisphenol type epoxy resin or a mixture of a bisphenol type epoxy resing with an epoxy resin havng a compatibility with said bisphenol type epoxy resin and structure similar to that of said bisphenol type epoxy resin but being quite different therefrom in a part of the structure in water with a polyoxyethylene benzylated phenyl ether having an HLB value of at least 15, and a curing agent and, if desired, a pigment and other additives.
    Type: Grant
    Filed: March 12, 1976
    Date of Patent: August 1, 1978
    Assignee: Dai Nippon Toryo Co., Ltd.
    Inventors: Minoru Hosoda, Eiichi Kasiwagi, Fumio Murayama, Kohei Isayama
  • Patent number: 4073762
    Abstract: An aqueous epoxy resin paint composition comprising an epoxy resin emulsion formed by emulsifying a bisphenol type epoxy resin or a mixture of a bisphenol type epoxy resin with an epoxy resin having a compatibility with said bisphenol type epoxy resin and a structure similar to that of said bisphenol type epoxy resin but being quite different therefrom in a part of the structure in water with a polyoxyethylene benzylated phenyl ether having an HLB value of at least 15, and a cutting agent and, if desired, a pigment and other additives.
    Type: Grant
    Filed: March 12, 1976
    Date of Patent: February 14, 1978
    Inventors: Minoru Hosoda, Eiichi Kasiwagi, Fumio Murayama, Kohei Isayama
  • Patent number: 3983056
    Abstract: An aqueous epoxy resin paint composition comprising an epoxy resin emulsion formed by emulsifying a bisphenol type epoxy resin or a mixture of a bisphenol type epoxy resin with an epoxy resin having a compatibility with said bisphenol type epoxy resin and a structure similar to that of said bisphenol type epoxy resin but being quite different therefrom in a part of the structure in water with a polyoxyethylene benzylated phenyl ether having an HLB value of at least 15, and a curing agent and, if desired, a pigment and other additives.
    Type: Grant
    Filed: September 25, 1974
    Date of Patent: September 28, 1976
    Assignee: Dai Nippon Toryo Co., Ltd.
    Inventors: Minoru Hosoda, Eiichi Kasiwagi, Fumio Murayama, Kohei Isayama