Abstract: An inductance element including: a support body including a main face including a first area and a second area surrounding the first area; a first resin body disposed within the first area; and an inductor provided at the main face of the support body, wherein the first resin body includes a first soft magnetic body layer and a second soft magnetic body layer that are both disposed inside the first area, wherein the inductor is positioned between the first soft magnetic body layer and the second soft magnetic body layer, wherein the first soft magnetic body layer includes a first insulating resin body and plural first magnetic bodies surrounded by the first insulating resin body, and wherein the second soft magnetic body layer includes a second insulating resin body and plural second magnetic bodies surrounded by the second insulating resin body.

Abstract: Reliability of joining between semiconductor chips is improved by promoting filling of a sealing resin into a gap formed between the semiconductor chips. A semiconductor device includes: a first semiconductor chip, which has a plurality of first electrodes on a surface; a second semiconductor chip, which is disposed to be separated by a gap from the surface of the first semiconductor chip, and which includes an inner peripheral area that has a plurality of second electrodes connected to each of the first electrodes on a surface and an outer peripheral area that surrounds the inner peripheral area and has a thickness thinner than the thickness of the inner peripheral area; and a sealing resin, which is respectively filled between the surface of the first semiconductor chip and the inner peripheral area, and between the surface of the first semiconductor chip and the outer peripheral area.

Abstract: Reliability of joining between semiconductor chips is improved by promoting filling of a sealing resin into a gap formed between the semiconductor chips. A semiconductor device includes: a first semiconductor chip, which has a plurality of first electrodes on a surface; a second semiconductor chip, which is disposed to be separated by a gap from the surface of the first semiconductor chip, and which includes an inner peripheral area that has a plurality of second electrodes connected to each of the first electrodes on a surface and an outer peripheral area that surrounds the inner peripheral area and has a thickness thinner than the thickness of the inner peripheral area; and a sealing resin, which is respectively filled between the surface of the first semiconductor chip and the inner peripheral area, and between the surface of the first semiconductor chip and the outer peripheral area.