Patents by Inventor Kohei Nishino
Kohei Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250092220Abstract: This polyamide resin composition includes a polyamide resin and a copper-based heat-resistant stabilizing agent. The copper content in the copper-based stabilizing agent is 0.001-0.050 parts by mass with respect to 100 parts by mass of the polyamide resin. The polyamide resin includes a dicarboxylic acid-derived component unit (a) and a diamine-derived component unit (b). The dicarboxylic acid-derived component unit (a) includes an aromatic dicarboxylic acid-derived component unit or an alicyclic dicarboxylic acid-derived component unit. The diamine-derived component unit (b) includes a diamine-derived component unit (b2) represented by formula (1) in an amount of 10 mol % or more but less than 50 mol % with respect to the total number of moles of the diamine-derived component unit (b).Type: ApplicationFiled: January 6, 2023Publication date: March 20, 2025Applicant: MITSUI CHEMICALS, INC.Inventors: Kosuke UEDA, Wataru MAKIGUCHI, Haruka DOI, Kohei NISHINO, Isao WASHIO, Takahiro KONDO
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Patent number: 12116438Abstract: A thermoplastic resin composition including polycarbonate and ABS resin having superior impact resistance, chemical resistance, flowability, and color phase, and a molded article thereof is provided. A thermoplastic resin composition includes maleimide based copolymer (A) including aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; polycarbonate (B); and at least one resin (C) selected from the group including ABS resin, ASA resin, AES resin, and SAN resin; wherein: the maleimide monomer unit is contained by 0.5 to 10 mass % and the polycarbonate (B) is contained by 20 to 70 mass % in 100 mass % of the thermoplastic resin composition.Type: GrantFiled: February 21, 2020Date of Patent: October 15, 2024Assignee: DENKA COMPANY LIMITEDInventors: Masanori Matsumoto, Kohei Nishino
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Publication number: 20240279372Abstract: A maleimide-based copolymer containing: 40% to 65% by mass of an aromatic vinyl-based monomer unit; and 35% to 60% by mass of a maleimide-based monomer unit, in which a residual amount of an aromatic vinyl-based monomer is 200 to 2000 ppm by mass, and a residual amount of a maleimide-based monomer is 30 to 400 ppm by mass.Type: ApplicationFiled: June 8, 2021Publication date: August 22, 2024Applicant: Denka Company LimitedInventors: Masanori MATSUMOTO, Kohei NISHINO
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Publication number: 20240228740Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.Type: ApplicationFiled: March 16, 2022Publication date: July 11, 2024Applicant: Mitsui Chemicals, Inc.Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
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Publication number: 20240158633Abstract: Provided is a polyamide resin composition that has high electrical resistance in a high temperature range (around 130° C.) and high heat resistance. The polyamide resin composition includes: a polyamide resin that includes a component unit (a) derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid and a component unit (b2) derived from a diamine represented by formula (1); and at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) containing a specific phosphinate compound, a specific bisphosphinate compound, or a polymer of these compounds. In formula (1), n and the two instances of m are each independently 0 or 1, and —X— is a single bond or a divalent group selected from the group consisting of —O—, —S—, —SO2—, —CO—, and —CH2—.Type: ApplicationFiled: March 18, 2022Publication date: May 16, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Wataru MAKIGUCHI, Haruka DOI, Kohei NISHINO, Isao WASHIO
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Publication number: 20240141165Abstract: Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130° C.) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid or alicyclic dicarboxylic acid and a component unit (b2) deriving from 1,3-bis(aminomethyl)cyclohexane. The polyamide resin composition further comprises at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) comprising a prescribed phosphinate salt compound or bisphosphinate salt compound or a polymer thereof.Type: ApplicationFiled: March 16, 2022Publication date: May 2, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
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Publication number: 20240132695Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.Type: ApplicationFiled: March 15, 2022Publication date: April 25, 2024Applicant: Mitsui Chemicals, Inc.Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
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Publication number: 20240076485Abstract: A fiber for artificial hair with low thermal shrinkage, low luster, and excellent spinnability, structured by a resin composition containing a vinyl chloride-based resin and a maleimide-based copolymer, wherein: 50 to 99 mass % of the vinyl chloride-based resin is contained in 100 mass % of the resin composition; 1 to 50 mass % of the maleimide-based copolymer is contained in 100% of the resin composition; and when a total of an aromatic vinyl-based monomer unit, a cyanide vinyl-based monomer unit, an unsaturated acid anhydride monomer unit, and a maleimide-based monomer unit in the maleimide-based copolymer is 100 mass %, the maleimide-based copolymer has 5 to 30 mass % of the maleimide-based monomer unit.Type: ApplicationFiled: March 8, 2022Publication date: March 7, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takashi MURAOKA, Yuki SAGARA, Tatsuhiro MATSUBARA, Kohei NISHINO
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Publication number: 20230311394Abstract: A method for manufacturing a heat resistant resin composition having superior dispersibility of maleimide-based copolymer, the method including: a melt-kneading step to melt and knead a maleimide-based copolymer (A) and at least one resin (B) selected from the group consisting of ABS resin, ASA resin, AES resin, and SAN resin with an extruder; wherein: a ratio of a melt viscosity of the maleimide-based copolymer (A) with respect to a melt viscosity of the resin (B) obtained with a shear rate of 120/sec and a cylinder temperature of a kneading unit of the extruder is 1.0 or higher and lower than 3.4, is provided.Type: ApplicationFiled: September 22, 2021Publication date: October 5, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kohei NISHINO, Tatsuhiro MATSUBARA
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Publication number: 20230294346Abstract: A maleimide-based copolymer having superior dispersibility during melt extrusion and kneading. A maleimide-based copolymer having an average particle diameter of 75 ?m or larger and a cumulative oversize at 1000 ?m of lower than 5 mass %.Type: ApplicationFiled: September 22, 2021Publication date: September 21, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kohei NISHINO, Masamichi ENDO
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Publication number: 20230250270Abstract: A resin composition including a maleimide copolymer (A), a graft copolymer (B), and a vinyl copolymer (C), and with respect to a total amount of 100 parts by mass of the maleimide copolymer (A), the graft copolymer (B) and the vinyl copolymer (C), a total content of the aromatic vinyl monomer unit is 55 to 65 parts by mass, a total content of the vinyl cyanide monomer unit is 15 to 27 parts by mass, a total content of the maleimide monomer unit is 3 to 15 parts by mass, and a total content of the conjugated diene monomer unit is 10 to 20 parts by mass, and the melt mass flow rate under conditions of 220° C. and a load of 98 N is 3 to 23 g/10 min.Type: ApplicationFiled: June 8, 2021Publication date: August 10, 2023Applicant: Denka Company LimitedInventors: Masanori MATSUMOTO, Kohei NISHINO
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Publication number: 20230203247Abstract: Provided is a crystalline polyamide resin that can exhibit a high mechanical strength and electrical resistance in high temperature regions (in the neighborhood of 150° C.). This polyamide resin has the following: a dicarboxylic acid-derived component unit (a) that includes a component unit (a1) derived from terephthalic acid, naphthalenedicarboxylic acid, or cyclohexanedicarboxylic acid, at more than 20 mol % and up to and including 100 mol % with reference to the total number of moles of the dicarboxylic acid-derived component unit (a); and a diamine-derived component unit (b) that contains a component unit (b1) deriving from alkylenediamine having 4-18 carbon atoms and a component unit (b2) deriving from diamine given by formula (1).Type: ApplicationFiled: July 5, 2021Publication date: June 29, 2023Applicant: MITSUI CHEMICALS, INC.Inventors: Kohei NISHINO, Toshitaka KOSAKA, Isao WASHIO
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Publication number: 20230183480Abstract: A maleimide-based copolymer which allows to obtain a resin composition having balanced heat resistance providing property and impact resistance, superior flowabillty, and low yellowness (YI); a maleimide-based copolymer composition using such maleimide-based copolymer; a resin composition.; and an injection molded body are provided. A maleimide-based copolymer, including: aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; wherein: the maleimide-based copolymer has a weight average molecular weight of 50,000 to 110,000; and the maleimide-based copolymer has a mid-point glass transition temperature measured in accordance with JIS K-7121 of 165° C. to 200° C., is provided.Type: ApplicationFiled: July 20, 2021Publication date: June 15, 2023Applicant: DENKA COMPANY LIMITEDInventors: Soichiro NAKANISHI, Masanori MATSUMOTO, Kohei NISHINO
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Patent number: 11673341Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.Type: GrantFiled: February 15, 2019Date of Patent: June 13, 2023Assignee: MITSUI CHEMICALS, INC.Inventors: Kohei Nishino, Yohei Hotani, Isao Washio
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Publication number: 20220356285Abstract: A maleimide based copolymer, manufacturing method thereof, and a resin composition using the maleimide based copolymer is provided. The maleimide based copolymer includes 40 to 60 mass % of aromatic vinyl monomer unit, 5 to 20 mass % of vinyl cyanide monomer unit, 35 to 50 mass % of maleimide monomer unit, and 0 to 10 mass % of monomer copolymerizable with these monomer units. The maleimide based copolymer has a glass transition temperature of 165° C. or higher and a melt mass flow rate of 25 to 80 g/10 min measured at 265° C. with 98 N load. By using such maleimide based copolymer, flowability can be improved without decreasing heat resistance providing ability.Type: ApplicationFiled: July 7, 2020Publication date: November 10, 2022Applicant: DENKA COMPANY LIMITEDInventors: Soichiro NAKANISHI, Masanori MATSUMOTO, Kohei NISHINO
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Publication number: 20220195174Abstract: A maleimide based copolymer, manufacturing method thereof, and a resin composition using the maleimide based copolymer is provided. A maleimide based copolymer includes 40 to 60 mass % of aromatic vinyl monomer unit, 5 to 20 mass % of vinyl cyanide monomer unit, 25 to 50 mass % of maleimide monomer unit, 0.1 to 10 mass % of dicarboxylic anhydride monomer unit; wherein the maleimide based copolymer has a glass transition temperature of 165 to 200° C.; and an average number of the dicarboxylic anhydride monomer unit contained in one copolymer molecule is 1 to 30 units. Further, a resin composition is obtained by kneading and mixing the maleimide based copolymer with one or two or more resin selected from the group including ABS resin, ASA resin, AES resin, and SAN resin. The resin composition is superior in the balance of surface glossiness, heat resistance, impact resistance, and flowability.Type: ApplicationFiled: July 7, 2020Publication date: June 23, 2022Applicant: DENKA COMPANY LIMITEDInventors: Tatsuhiro MATSUBARA, Masanori MATSUMOTO, Kohei NISHINO
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Publication number: 20220195094Abstract: A thermoplastic resin composition including polycarbonate and ABS resin having superior impact resistance, chemical resistance, flowability, and color phase, and a molded article thereof is provided. A thermoplastic resin composition includes maleimide based copolymer (A) including aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; polycarbonate (B); and at least one resin (C) selected from the group including ABS resin, ASA resin, AES resin, and SAN resin; wherein: the maleimide monomer unit is contained by 0.5 to 10 mass % and the polycarbonate (B) is contained by 20 to 70 mass % in 100 mass % of the thermoplastic resin composition.Type: ApplicationFiled: February 21, 2020Publication date: June 23, 2022Applicant: DENKA COMPANY LIMITEDInventors: Masanori MATSUMOTO, Kohei NISHINO
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Publication number: 20210101347Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.Type: ApplicationFiled: February 15, 2019Publication date: April 8, 2021Applicant: MITSUI CHEMICALS, INC.Inventors: Kohei NISHINO, Yohei HOTANI, Isao WASHIO
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Patent number: 10872268Abstract: A body part point detection module detects multiple first body part points associated with a first person image contained in a first image and multiple second body part points associated with second person images contained in a second image. An identicality determination module calculates color differences between the color information of the pixels corresponding to the multiple first body part points of the first person image and the respective color information of the pixels corresponding to the multiple second body part points of the second person images, and uses the calculated color differences to calculate the degree of color similarity between the first person image and second person image and the degree of color similarity between the first person image and second person image. The identicality determination module uses the calculated degrees of color similarity to determine identicality between the first person image and second person images.Type: GrantFiled: August 23, 2018Date of Patent: December 22, 2020Assignee: DeNA Co., Ltd.Inventors: Kohei Nishino, Tianqi Li
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Publication number: 20190065900Abstract: A body part point detection module detects multiple first body part points associated with a first person image contained in a first image and multiple second body part points associated with second person images contained in a second image. An identicality determination module calculates color differences between the color information of the pixels corresponding to the multiple first body part points of the first person image and the respective color information of the pixels corresponding to the multiple second body part points of the second person images, and uses the calculated color differences to calculate the degree of color similarity between the first person image and second person image and the degree of color similarity between the first person image and second person image. The identicality determination module uses the calculated degrees of color similarity to determine identicality between the first person image and second person images.Type: ApplicationFiled: August 23, 2018Publication date: February 28, 2019Inventors: Kohei NISHINO, Tianqi LI