Abstract: A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.

Abstract: The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

Abstract: A surface property judging method and a surface property judging system for a polishing pad capable of appropriately judging a surface property of the polishing pad are disclosed. The surface property judging method includes: rotating a polishing table together with a polishing pad which is supported by the polishing table; generating surface data by a surface data generator, the surface data containing a plurality of shape index values representing a surface property of the polishing pad; producing a histogram indicating a distribution of the plurality of shape index values based on the surface data; and judging the surface property of the polishing pad based on the histogram.

Abstract: An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film.

Abstract: An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film.

Abstract: It is an object to provide a thin-type full-color display device with the long lifetime, inexpensively, in which desired emission luminance and desired color purity can be obtained at a low voltage. In a light-emitting device capable of full-color display, among a plurality of light-emitting elements emitting different emission colors (for example, colors of red (R), green (G), and blue (B)), at least one of the light-emitting elements of an emission color is a light-emitting element including an organic compound (an organic EL element), and the other light-emitting element of an emission color is a light-emitting element using an inorganic material as a light-emitting layer or a fluorescent layer (an inorganic EL element). It is to be noted that the organic EL element and the inorganic EL element are formed over the same substrate.