Abstract: This metal paste for bonding includes a metal powder, a copper salt, an amine, and an alcohol, in which a ratio A/B of a weight A of Cu in the copper salt to a weight B of the metal powder is set to be in a range of 0.02 or more and 0.25 or less, the metal paste is in a paste form in a temperature range of 15° C. or higher and 35° C. or lower, a liquid phase is generated in a temperature raising process starting from 35° C., the liquid phase dissipates in the temperature raising process at a liquid phase generation temperature or higher, and a metal sintered body is formed at a liquid phase dissipation temperature or higher.

Abstract: Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.

Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

Abstract: Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m2/g to 8 m2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a range of 0.5% to 2.0% by mass with respect to the particles for joining material. When the particles for joining material are analyzed by using the Time-Of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) method, respective detected amounts of C3H3O3? ions and C3H4O2? ions are in a range of 0.05 times to 0.2 times a detected amount of Cu+ ions, and a detected amount of ions of C5 or more is in a range less than 0.005 times the detected amount of Cu+ ions.