Abstract: Provided are a pressure-sensitive adhesive composition that has a sufficient initial pressure-sensitive adhesive strength and can achieve both a resealing property and an easy unsealing property, and a pressure-sensitive adhesive tape using the pressure-sensitive adhesive composition. A hot-melt pressure-sensitive adhesive composition according to an embodiment of the present invention includes a styrene-based elastomer, an olefin-based elastomer, and a tackifier. The hot-melt pressure-sensitive adhesive composition includes 2 wt % to 80 wt % of the styrene-based elastomer, 2 wt % to 50 wt % of the olefin-based elastomer, and 2 wt % to 40 wt % of the tackifier.

Abstract: Provided are a pressure-sensitive adhesive tape in which anchoring failure is suppressed and a method of producing the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape includes a base material including an olefin-based resin, a first pressure-sensitive adhesive layer including an olefin-based resin, and a second pressure-sensitive adhesive layer including a styrene-based elastomer in the stated order.

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: Provided is a stretchable film having excellent stretchability, excellent air permeability, and an excellent deodorizing property. Also provided is an article including such stretchable film. A stretchable film of the present invention is a film having stretchability, and includes a deodorant. The stretchable film of the present invention is a film having stretchability, and has a deodorization efficiency for each of ammonia and hydrogen sulfide 3 hours after the start of a deodorization test, the deodorization efficiency being measured by a detector tube method, of 10% or more.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.

Abstract: Provided is a stretchable laminate that achieves both a weight reduction and an extension strength, and that can be stably produced. Also provided is an article including such stretchable laminate. The stretchable laminate of the present invention includes: an elastomer layer; and an olefin-based resin layer arranged on at least one side of the elastomer layer, wherein when a longitudinal direction of the stretchable laminate is defined as an MD direction and a direction perpendicular to the longitudinal direction is defined as a CD direction, a ratio [10% extension strength in MD direction (N/30 mm)]/[basis weight (gsm)] of the stretchable laminate is 0.14 (N/30 mm·gsm) or more.

Abstract: Provided is a stretchable film having excellent stretchability and excellent air permeability. Also provided is an article including such stretchable film. The stretchable film of the present invention includes an olefin-based resin and a filler.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.