Abstract: The present invention provides an imprint apparatus which forms a pattern in an imprint material on a substrate using a mold, the apparatus comprising a deformation unit configured to deform at least one of the mold and the substrate, and a control unit configured to control a process of starting contact between the mold and the imprint material in a state in which the at least one is deformed, and then gradually increasing a contact area between the mold and the imprint material by gradually decreasing a deformation amount of the at least one, wherein the control unit controls relative positions of the mold and the substrate based on the deformation amount, so as to maintain a relative positional relationship between the mold and the substrate at a region where the mold and the imprint material are contact with each other.

Abstract: An imprint apparatus performs includes an irradiation unit which irradiates a resin on a substrate with light, and a control unit which controls the irradiation unit. The imprinting is performed in an edge shot region, including an edge of the substrate, of a plurality of shot regions on the substrate. The edge shot region includes a pattern forming region where a pattern is to be formed, and a near-edge region closer to a side of the edge than the pattern forming region, and the control unit controls the irradiation unit to irradiate the resin which spreads from a position on the pattern forming region to a position on the near-edge region as the pattern surface comes into contact with the resin in the pattern forming region.

Abstract: A method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein each shot region includes at least one of at least one valid chip area and at least one invalid chip area, the invalid chip area including an inhibited area in which resin coating is inhibited, the imprint process for a shot region including both the invalid chip area and the valid chip area includes coating the valid chip area of the shot region with the resin, bringing a pattern surface of a mold into contact with the resin, and curing the resin, and in the step of coating, at least the inhibited area of the invalid chip area is not coated with the resin.

Abstract: The present invention provides an imprint apparatus which forms a pattern in an imprint material on a substrate using a mold, the apparatus comprising a deformation unit configured to deform at least one of the mold and the substrate, and a control unit configured to control a process of starting contact between the mold and the imprint material in a state in which the at least one is deformed, and then gradually increasing a contact area between the mold and the imprint material by gradually decreasing a deformation amount of the at least one, wherein the control unit controls relative positions of the mold and the substrate based on the deformation amount, so as to maintain a relative positional relationship between the mold and the substrate at a region where the mold and the imprint material are contact with each other.

Abstract: An imprint apparatus includes plural pressing members configured to press a side surface of a mold and plural actuators configured to drive each pressing member in a direction parallel to the pattern surface. The each pressing member has a tapered portion on a side of the mold. A contact portion contacting the side surface of the mold out of the tapered portion extends in a direction perpendicular to the pattern surface.

Abstract: An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface.

Abstract: An imprint apparatus performs includes an irradiation unit which irradiates a resin on a substrate with light, and a control unit which controls the irradiation unit. The imprinting is performed in an edge shot region, including an edge of the substrate, of a plurality of shot regions on the substrate. The edge shot region includes a pattern forming region where a pattern is to be formed, and a near-edge region closer to a side of the edge than the pattern forming region, and the control unit controls the irradiation unit to irradiate the resin which spreads from a position on the pattern forming region to a position on the near-edge region as the pattern surface comes into contact with the resin in the pattern forming region.

Abstract: A method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein each shot region includes at least one of at least one valid chip area and at least one invalid chip area, the invalid chip area including an inhibited area in which resin coating is inhibited, the imprint process for a shot region including both the invalid chip area and the valid chip area includes coating the valid chip area of the shot region with the resin, bringing a pattern surface of a mold into contact with the resin, and curing the resin, and in the step of coating, at least the inhibited area of the invalid chip area is not coated with the resin.

Abstract: An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface.