Patents by Inventor Kohichi Morimoto

Kohichi Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149951
    Abstract: A center pillar reinforcement and a roof rail, to which an upper end portion of the center pillar reinforcement is fixed are provided. The roof rail comprises a protrusion portion protruding in a vehicle width direction and extending in a vehicle longitudinal direction. The protrusion portion comprises a fixation portion where the upper end portion is fixed and a terminal end portion separate, in the vehicle longitudinal direction, from the center pillar reinforcement.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 9, 2024
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Makoto MORIMOTO, Daisuke KIYOSHITA, Shuang GAO, Kohichi TANIMOTO
  • Patent number: 7183892
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Grant
    Filed: July 19, 2004
    Date of Patent: February 27, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
  • Publication number: 20040252006
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Application
    Filed: July 19, 2004
    Publication date: December 16, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
  • Patent number: 6782604
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: August 31, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
  • Patent number: 6441717
    Abstract: A chip polymer PTC thermistor for surface mount assembly having a superior long-term connection reliability between side electrode and main and sub electrodes. The thermister comprises; a rectangular parallelepiped conductive polymer(11) having PTC properties; a first main electrode(12a) and a first sub electrode(12b) disposed on a first face of the conductive polymer; a second main electrode(12c) and a second sub electrode(12d) disposed on a second face opposite the first face of the conductive polymer; and first and second side electrodes(13a,13b) folding around and over the entire surface of side faces of the conductive polymer, the side electrodes electrically coupling the electrodes disposed on the two faces of the conductive polymer, and a thickness of the side electrodes is not less than one twentieth of the distance between the first main electrode(12a) and the second sub electrode(12d) and the distance between the first sub electrode(12b) and second main electrode(12a,12c).
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: August 27, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Ikeda, Kohichi Morimoto, Junji Kojima, Kiyoshi Ikeuchi, Toshiyuki Iwao
  • Patent number: 6438821
    Abstract: The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which no failure in electrical connection occurs in side electrode even when a mechanical stress occurs due to the thermal shock by repeated thermal expansion of the conductive polymer sheet. It also aims to provide a method to manufacture the above PTC thermister. To achieve the above purpose, the PTC thermister of the present invention comprises (1)a laminated body made by alternately laminating conductive polymer sheets and inner electrodes, (2) outer electrodes disposed on tops and bottoms of said laminated body and (3) multi-layered side electrodes disposed at the center of both sides of said laminated body and is electrically coupled with said inner electrodes and said outer electrodes.
    Type: Grant
    Filed: January 11, 2000
    Date of Patent: August 27, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto
  • Publication number: 20020021203
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Application
    Filed: February 16, 2000
    Publication date: February 21, 2002
    Inventors: JUNJI KOJIMA, KOHICHI MORIMOTO, TAKASHI IKEDA, TOSHIYUKI IWAO
  • Patent number: 6188308
    Abstract: The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which no failure in electrical connection occurs in side electrode even when a mechanical stress occurs due to the thermal shock by repeated thermal expansion of the conductive polymer sheet. It also aims to provide a method to manufacture the above PTC thermister. To achieve the above purpose, the PTC thermister of the present invention comprises (1) a laminated body made by alternately laminating conductive polymer sheets and inner electrodes, (2) outer electrodes disposed on tops and bottoms of said laminated body and (3) multi-layered side electrodes disposed at the center of both sides of said laminated body and is electrically coupled with said inner electrodes and said outer electrodes.
    Type: Grant
    Filed: July 23, 1999
    Date of Patent: February 13, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto
  • Patent number: 6157289
    Abstract: The invention presents a PTC thermistor which is high in adhesive strengths of inner- and outer-layer electrodes composed of metallic foil respectively stuck to conductive sheets, and has a larger current breaking characteristic. It contains a laminated body (13) which is formed by alternately laminating a plurality of conductive sheets (14) and an inner-layer electrode (11) composed of metallic foil having first plated layers (12) so that the conductive sheets (14) can become the outermost layers, an outer-layer electrode (18) positioned at the outermost layer of the laminated body (13), and having a second plated layer (16) on a side facing the inner-layer electrode (11), and side-face electrode layers 20) disposed at facing sides of the laminated body 913) for connecting electrically the inner-layer electrode (11) and outer-layer electrode (18).
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: December 5, 2000
    Assignee: Mitsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto