Patents by Inventor Kohichi Morimoto
Kohichi Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149951Abstract: A center pillar reinforcement and a roof rail, to which an upper end portion of the center pillar reinforcement is fixed are provided. The roof rail comprises a protrusion portion protruding in a vehicle width direction and extending in a vehicle longitudinal direction. The protrusion portion comprises a fixation portion where the upper end portion is fixed and a terminal end portion separate, in the vehicle longitudinal direction, from the center pillar reinforcement.Type: ApplicationFiled: October 19, 2023Publication date: May 9, 2024Applicant: MAZDA MOTOR CORPORATIONInventors: Makoto MORIMOTO, Daisuke KIYOSHITA, Shuang GAO, Kohichi TANIMOTO
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Patent number: 7183892Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: GrantFiled: July 19, 2004Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Publication number: 20040252006Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: ApplicationFiled: July 19, 2004Publication date: December 16, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Patent number: 6782604Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: GrantFiled: February 16, 2000Date of Patent: August 31, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Patent number: 6441717Abstract: A chip polymer PTC thermistor for surface mount assembly having a superior long-term connection reliability between side electrode and main and sub electrodes. The thermister comprises; a rectangular parallelepiped conductive polymer(11) having PTC properties; a first main electrode(12a) and a first sub electrode(12b) disposed on a first face of the conductive polymer; a second main electrode(12c) and a second sub electrode(12d) disposed on a second face opposite the first face of the conductive polymer; and first and second side electrodes(13a,13b) folding around and over the entire surface of side faces of the conductive polymer, the side electrodes electrically coupling the electrodes disposed on the two faces of the conductive polymer, and a thickness of the side electrodes is not less than one twentieth of the distance between the first main electrode(12a) and the second sub electrode(12d) and the distance between the first sub electrode(12b) and second main electrode(12a,12c).Type: GrantFiled: December 15, 2000Date of Patent: August 27, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takashi Ikeda, Kohichi Morimoto, Junji Kojima, Kiyoshi Ikeuchi, Toshiyuki Iwao
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Patent number: 6438821Abstract: The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which no failure in electrical connection occurs in side electrode even when a mechanical stress occurs due to the thermal shock by repeated thermal expansion of the conductive polymer sheet. It also aims to provide a method to manufacture the above PTC thermister. To achieve the above purpose, the PTC thermister of the present invention comprises (1)a laminated body made by alternately laminating conductive polymer sheets and inner electrodes, (2) outer electrodes disposed on tops and bottoms of said laminated body and (3) multi-layered side electrodes disposed at the center of both sides of said laminated body and is electrically coupled with said inner electrodes and said outer electrodes.Type: GrantFiled: January 11, 2000Date of Patent: August 27, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto
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Publication number: 20020021203Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: ApplicationFiled: February 16, 2000Publication date: February 21, 2002Inventors: JUNJI KOJIMA, KOHICHI MORIMOTO, TAKASHI IKEDA, TOSHIYUKI IWAO
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Patent number: 6188308Abstract: The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which no failure in electrical connection occurs in side electrode even when a mechanical stress occurs due to the thermal shock by repeated thermal expansion of the conductive polymer sheet. It also aims to provide a method to manufacture the above PTC thermister. To achieve the above purpose, the PTC thermister of the present invention comprises (1) a laminated body made by alternately laminating conductive polymer sheets and inner electrodes, (2) outer electrodes disposed on tops and bottoms of said laminated body and (3) multi-layered side electrodes disposed at the center of both sides of said laminated body and is electrically coupled with said inner electrodes and said outer electrodes.Type: GrantFiled: July 23, 1999Date of Patent: February 13, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto
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Patent number: 6157289Abstract: The invention presents a PTC thermistor which is high in adhesive strengths of inner- and outer-layer electrodes composed of metallic foil respectively stuck to conductive sheets, and has a larger current breaking characteristic. It contains a laminated body (13) which is formed by alternately laminating a plurality of conductive sheets (14) and an inner-layer electrode (11) composed of metallic foil having first plated layers (12) so that the conductive sheets (14) can become the outermost layers, an outer-layer electrode (18) positioned at the outermost layer of the laminated body (13), and having a second plated layer (16) on a side facing the inner-layer electrode (11), and side-face electrode layers 20) disposed at facing sides of the laminated body 913) for connecting electrically the inner-layer electrode (11) and outer-layer electrode (18).Type: GrantFiled: March 9, 1999Date of Patent: December 5, 2000Assignee: Mitsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto