Abstract: A wafer tray includes a tray main body and a plurality of wafer guides. The tray main body includes a major surface having a first diameter. A wafer placing region is defined on the major surface. A wafer having a second diameter smaller than the first diameter can be placed in the wafer placing region. The plurality of wafer guides is discretely disposed outside the wafer placing region and adjacent to an outline of the wafer placing region on the major surface. Each of the wafer guides includes a back surface fixed in contact with the major surface and a top portion higher than the major surface of the tray main body.

Abstract: A wafer tray includes a tray main body and a plurality of wafer guides. The tray main body includes a major surface having a first diameter. A wafer placing region is defined on the major surface. A wafer having a second diameter smaller than the first diameter can be placed in the wafer placing region. The plurality of wafer guides is discretely disposed outside the wafer placing region and adjacent to an outline of the wafer placing region on the major surface. Each of the wafer guides includes a back surface fixed in contact with the major surface and a top portion higher than the major surface of the tray main body.

Abstract: A clamp member capable of reliably releasing sticking to a substrate with a simple structure, a film deposition apparatus and method, and a semiconductor device manufacturing method using the clamp member are provided. A clamp ring includes an inner flange portion, a rotating shaft arranged at the inner flange portion, and a rotating member. The rotating member is rotatable about the rotating shaft, and has front and rear end portions. The rotating member is arranged such that the front end portion is positioned to face a part of the wafer with a space therebetween when the inner flange portion is holding the wafer. When the rear end portion is pressed against the inner flange portion, the rotating member rotates about the rotating shaft, and thus, the front end portion can press the part of the wafer in a direction away from the inner flange portion.