Patents by Inventor Kohji Hirata

Kohji Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hypoglycemic agent
    Publication number: 20060148774
    Abstract: A hypoglycemic agent comprising a compound selected from the group consisting of 24-alkylcholestan-3-ones and 24-alkylcholesten-3-ones (for example, 24-alkylcholestan-3-ones, 24-alkylcholestmonoen-3-ones, 24-alkylcholestdien-3-ones, 24-alkylcholesttrien-3-ones, or 24-alkylcholesttetraen-3-ones, preferably 5-campesten-3-one) as an active ingredient. The agent can be used for improvement of hyperglycemia resulting from diseases such as diabetes, and can be used as a safe medicament without side effects such as hypoglycemia or diarrhea.
    Type: Application
    Filed: February 27, 2006
    Publication date: July 6, 2006
    Applicants: Riken, Japan Science and Technology Agency, Kunio SUZUKI
    Inventors: Kunio Suzuki, Kohji Hirata, Rie Konno, Miwa Moriizumi
  • Hypoglycemic agent
    Publication number: 20050227954
    Abstract: A hypoglycemic agent comprising a compound selected from the group consisting of 24-alkylcholestan-3-ones and 24-alkylcholesten-3-ones (for example, 24-alkylcholestan-3-ones, 24-alkylcholestmonoen-3-ones, 24-alkylcholestdien-3-ones, 24-alkylcholesttrien-3-ones, or 24-alkylcholesttetraen-3-ones, preferably 5-campesten-3-one) as an active ingredient. The agent can be used for improvement of hyperglycemia resulting from diseases such as diabetes, and can be used as a safe medicament without side effects such as hypoglycemia or diarrhea.
    Type: Application
    Filed: August 2, 2002
    Publication date: October 13, 2005
    Applicant: Riken Japan Science And Technology
    Inventors: Kunio Suzuki, Kohji Hirata, Rie Konno, Miwa Moriizumi
  • Process for manufacturing multilayer printed wiring board
    Patent number: 5116440
    Abstract: In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.
    Type: Grant
    Filed: February 6, 1990
    Date of Patent: May 26, 1992
    Assignee: Risho Kogyo Co., Ltd.
    Inventors: Kazunori Takeguchi, Kohji Hirata