Patents by Inventor Kohji HORI

Kohji HORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid epoxy resin composition for sealing, and electronic component device
    Patent number: 11059966
    Abstract: A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Naoyuki Nojiri, Hisato Takahashi, Makoto Kunimi, Kohji Hori
  • LIQUID EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190127571
    Abstract: A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.
    Type: Application
    Filed: April 25, 2017
    Publication date: May 2, 2019
    Inventors: Naoyuki NOJIRI, Hisato TAKAHASHI, Makoto KUNIMI, Kohji HORI