Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

Abstract: A multilayer wiring substrate which includes a glass ceramic section, a wiring layer section having a plurality of wiring layers electrically insulated from each other by a polyimide material, and an intermediate layer made of an inorganic material and arranged between the ceramic section and the wiring layer section.

Abstract: A multilayer wiring substrate is disclosed which includes a reconfigurable link structure for effecting wiring change. A plurality of pad portions are connected to a link structure through holes on an insulating layer located therebetween which also acts as a solder dam. A gap is present on a portion of the insulating layer through which a portion of the link structure is exposed. By cutting away the portion so exposed, the link structure is divided, and pad portions connected to the divided portions of the link structure become disconnected. An external wire may be selectively soldered to any one pad portion while the insulating layer acts as a soldering dam for preventing flow of solder onto the base wiring substrate section below the link structure. Because the insulating layer acts as a solder dam, the pad portions may be fabricated with materials conducive to solder wettability and severability.