Patents by Inventor Kohji Kitao

Kohji Kitao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070158105
    Abstract: A multilayer wiring board 10 has a high-capacitance layer 121 formed between a ground layer 141 and a power supply layer 15 and a high-capacitance layer 122 formed between the power supply layer 15 and a ground layer 142. The high-capacitance layers 121 and 122 are different in capacitance from each other. The multilayer wiring board 10 incorporates two capacitors which share the power supply layer 15 with each other and which are different in capacitance from each other.
    Type: Application
    Filed: November 16, 2006
    Publication date: July 12, 2007
    Inventors: Kohji Kitao, Hiroshi Kamiya, Takanori Saeki
  • Patent number: 4478990
    Abstract: A room temperature curing elastic composition useful as a sealing material which comprises as a main component a polymer produced from(a) at least one acrylic ester monomer of the formula:CH.sub.2 .dbd.CHCOOR.sub.1wherein R.sub.1 is an alkyl having 2 to 8 carbon atoms;(b) at least one member selected from the group consisting of vinylalkoxysilane of the formula: ##STR1## wherein R.sub.2 is an alkyl having 1 to 4 carbon atoms, X is methoxy or ethoxy, and a is 0, 1 or 2; and a (meth)acryloxyalkoxysilane of the formula: ##STR2## wherein R.sub.3 is hydrogen or methyl, R.sub.4 is a divalent hydrocarbon group, R.sub.5 is an alkyl having 1 to 4 carbon atoms, Y is methoxy or ethoxy, and b is 0, 1 or 2; and(c) a chain transfer agent having a mercapto group.
    Type: Grant
    Filed: April 26, 1982
    Date of Patent: October 23, 1984
    Assignee: Sunstar Giken Kabushiki Kaisha
    Inventors: Kiyoshi Kohno, Satoshi Nishikawa, Yoshiya Hattori, Kohji Kitao