Patents by Inventor Kohji Narui

Kohji Narui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper clad laminate
    Patent number: 10377110
    Abstract: A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 ?m and a copper foil having a thickness of 1 to 18 ?m.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: August 13, 2019
    Assignee: UBE INDUSTRIES, LTD.
    Inventors: Kohji Narui, Masafumi Hashimoto, Takuro Kochiyama
  • COPPER CLAD LAMINATE
    Publication number: 20160082703
    Abstract: A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 ?m and a copper foil having a thickness of 1 to 18 ?m.
    Type: Application
    Filed: December 7, 2015
    Publication date: March 24, 2016
    Inventors: Kohji Narui, Masafumi Hashimoto, Takuro Kochiyama
  • Copper-clad laminate
    Patent number: 7998553
    Abstract: A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ?500 N/m and the polyimide film shows a light transmittance of ?40% for a light of wavelength of 600 nm and a haze of ?30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: August 16, 2011
    Assignee: Ube Industries, Ltd.
    Inventors: Kohji Narui, Nobuyuki Yamamoto, Toshihiko Anno
  • COPPER-CLAD LAMINATE
    Publication number: 20100316884
    Abstract: A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ?500 N/m and the polyimide film shows a light transmittance of ?40% for a light of wavelength of 600 nm and a haze of ?30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
    Type: Application
    Filed: July 19, 2010
    Publication date: December 16, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Kohji Narui, Nobuyuki Yamamoto, Toshihiko Anno
  • COPPER CLAD LAMINATE
    Publication number: 20090142607
    Abstract: A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 ?m and a copper foil having a thickness of 1 to 18 ?m.
    Type: Application
    Filed: April 4, 2006
    Publication date: June 4, 2009
    Applicant: UBE Industries Ltd
    Inventors: Kohji Narui, Masafumi Hashimoto, Takuro Kochiyama
  • Polyimide-copper composite laminate
    Publication number: 20060154037
    Abstract: A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 ?m and a thin copper film having a thickness of 1-8 ?m, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
    Type: Application
    Filed: February 9, 2005
    Publication date: July 13, 2006
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Kohji Narui, Toshinori Hosoma, Toshihiko Anno
  • Copper-clad laminate
    Patent number: 6924024
    Abstract: A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ?500 N/m and the polyimide film shows a light transmittance of ?40% for a light of wavelength of 600 nm and a haze of ?30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: August 2, 2005
    Assignee: Ube Industries Ltd.
    Inventors: Kohji Narui, Nobuyuki Yamamoto, Toshihiko Anno
  • Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device
    Patent number: 6838184
    Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 ?m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2ยท24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: January 4, 2005
    Assignee: Ube Industries, Ltd.
    Inventors: Takuji Takahashi, Toshihiko Anno, Kohji Narui, Shozo Katsuki
  • Copper-clad laminate
    Publication number: 20040110015
    Abstract: A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≧30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
    Type: Application
    Filed: July 21, 2003
    Publication date: June 10, 2004
    Applicant: Ube Industries, Ltd.
    Inventors: Kohji Narui, Nobuyuki Yamamoto, Toshihiko Anno
  • Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device
    Publication number: 20030180557
    Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 &mgr;m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
    Type: Application
    Filed: March 21, 2003
    Publication date: September 25, 2003
    Applicant: Ube Industries, Ltd.
    Inventors: Takuji Takahashi, Toshihiko Anno, Kohji Narui, Shozo Katsuki
  • Aromatic polyimide film and film laminate
    Patent number: 6548180
    Abstract: An aromatic polyimide film of polyimide composed of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 &mgr;m and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: April 15, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Tomohiko Yamamoto, Takuji Takahashi, Kohji Narui, Hiroto Mitsui, Norihisa Komoda
  • Aromatic polyimide film and film laminate
    Publication number: 20020058149
    Abstract: An aromatic polyimide film of polyimide composed of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 &mgr;m and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
    Type: Application
    Filed: October 2, 2001
    Publication date: May 16, 2002
    Inventors: Tomohiko Yamamoto, Takuji Takahashi, Kohji Narui, Hiroto Mitsui, Norihisa Komoda